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JEDEC memory standards

The JEDEC memory standards are the specifications for semiconductor memory circuits and similar storage devices promulgated by the Joint Electron… 
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Review
2011
Review
2011
Issues of thermal testing of AC LEDs
In this paper we aim at highlighting different aspects of thermal testing of AC LEDs, especially of retrofit LED lamps which are… 
2010
2010
Study on board level solder joints reliability analysis of the copper stud bump flip-chip
In this paper, the investigation focuses on the copper stud bump solder joint thermal-mechanical reliability. The copper stud… 
2010
2010
Corrosion protection of anisotropically conductive adhesive joined flip chips
2009
2009
Standards, Intellectual Property Disclosure, and Patent Royalties after Rambus
2008
2008
Study of JEDEC B-condition JESD22-B111 standard for drop test reliability of Chip Scale Packages
The general tendency of the portable handheld electronic is to integrate more and more functionalities (phone, audio, video… 
2007
2007
Strategic Networking in Standard Setting Organizations: The Case of JEDEC
This paper examines the strategic impact of networking within a cooperative standard-setting body. The JEDEC JC-42 committee sets… 
2007
2007
Advantage and challenge of coreless flip-chip BGA
This paper described the shadow moire measurement of bare flip chip coreless and standard (3/2/3) BGA substrate to inspect the… 
2007
2007
Analysis of ESD protection structure behaviour after ageing as new approach for system level reliability of automotive power devices
2006
2006
RoHS Implementation Challenges
Implementation of the RoHS presents special challenges for small and medium sized companies. Limited staff and dependence on… 
1999
1999
Issues concerning CDM ESD verification modules-the need to move to alumina
In this work, we demonstrate that both capacitance and inductance must be the central parameters associated with the charged… 
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