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Highly accelerated stress test

Known as: HAST 
The highly accelerated stress test (HAST) method was invented by Nihal Sinnadurai while working as a Research Engineer at British Telecommunications… Expand
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Papers overview

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Highly Cited
2018
Highly Cited
2018
The development of an anomaly-based intrusion detection system (IDS) is a primary research direction in the field of intrusion… Expand
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2012
2012
In semiconductor packaging, wire bonding is the main technology for electrical connections between chip and leadframe or… Expand
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2012
2012
The white light emitting diode technology is developing rapidly in recent years. Evaluating the lifetime and failure rates of… Expand
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2012
2012
Cu wirebonding become a great interest of industry in recent years due to its cost effectiveness and electrical and mechanical… Expand
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Highly Cited
2010
Highly Cited
2010
There is growing interest in Cu wire bonding for LSI interconnection due to cost savings and better electrical and mechanical… Expand
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2010
2010
Alternative solutions for Au wire are high in demand as a result of increasing gold price and high demand for lower cost packages… Expand
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2009
2009
Flip chip packaging of ultra fine pitch integrated circuits (ICs) on organic substrates aggravates the stress-strain concerns… Expand
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Highly Cited
2009
Highly Cited
2009
This paper presents preliminary results of a copper—based Direct Bond Interconnect (DBI®) 3D integration process that has been… Expand
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Highly Cited
2004
Highly Cited
2004
This study was conducted in years 2000 to 2003 to compile a comprehensive list of naturalized species with background information… Expand
Highly Cited
1981
Highly Cited
1981
A method for highly accelerated bias-temperature humidity stress testing is described. This method allows testing in the regime… Expand
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