Highly accelerated stress test

The highly accelerated stress test (HAST) method was invented by Nihal Sinnadurai while working as a Research Engineer at British Telecommunications… (More)
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Topic mentions per year

Topic mentions per year

2003-2018
051020032018

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2016
2016
In our previous study, we investigated the effects of different packaging materials (silicone and phosphor layer) on the… (More)
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2016
2016
Article history: Received 10 July 2016 Accepted 11 July 2016 Available online xxxx The Highly Accelerated Stress Test (HAST) [130… (More)
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2013
2013
Cu wire bonding technology is increasingly being used for the various IC packages from consumer application to high-reliability… (More)
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2012
2012
In this work, as one of the failure modes of electronics packages, electrochemical migration failure of a multi-chip package is… (More)
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2012
2012
Innovative packaging technologies have delivered a remarkable generation of mobile devices, enabling the transition from simple… (More)
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2012
2012
This paper provides a detailed study on the challenges on development of a robust Cu wire bond process on thin aluminum (Al) bond… (More)
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2009
2009
This paper presents the development of wafer level embedding process for a three dimensional (3D) embedded micro wafer level… (More)
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2009
2009
More and more reliability and quality problems of electrical assemblies have to be solved due to the trend of miniaturization and… (More)
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2005
2005
In this study, Sn/Ag/Cu Pb-free solder paste was printed and reflowed onto a thin film Al/Ni(V)/Cu under bump metallization (UBM… (More)
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2003
2003
Flip chip on board (FCOB) technology has been in widespread application. The reliability testing of solder-joints and the… (More)
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