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Highly accelerated stress test

Known as: HAST 
The highly accelerated stress test (HAST) method was invented by Nihal Sinnadurai while working as a Research Engineer at British Telecommunications… 
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Related topics

Related topics

2 relations
Highly accelerated life testReliability engineering

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Silver alloy wire bonding
In semiconductor packaging, wire bonding is the main technology for electrical connections between chip and leadframe or… 
2012
2012
The investigation of LED's reliability through highly accelerated stress testing methods
The white light emitting diode technology is developing rapidly in recent years. Evaluating the lifetime and failure rates of… 
2010
2010
Reliability of palladium coated copper wire
Alternative solutions for Au wire are high in demand as a result of increasing gold price and high demand for lower cost packages… 
Highly Cited
2010
Highly Cited
2010
Improving humidity bond reliability of copper bonding wires
There is growing interest in Cu wire bonding for LSI interconnection due to cost savings and better electrical and mechanical… 
2009
2009
Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF
Flip chip packaging of ultra fine pitch integrated circuits (ICs) on organic substrates aggravates the stress-strain concerns… 
Highly Cited
2007
Highly Cited
2007
The Redistributed Chip Package: A Breakthrough for Advanced Packaging
The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance… 
Highly Cited
2007
Highly Cited
2007
Reliability of Cu Wire Bonding to Al Metallization
The use of Cu wire for thermosonic ball bonding presents several advantages over Au wire. These advantages include significant… 
2005
2005
Ball Aerospace Star Tracker Achieves High Tracking Accuracy for a Moving Star Field
Star trackers are traditionally a key component in spacecraft attitude control systems. Ball Aerospace has designed, developed… 
Review
2000
Review
2000
Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging
Transactions of the ASME, Journal of Electronic Packaging (ISSN 1043-7398) is published quarterly (March, June, Sept., Dec.) by… 
Highly Cited
1981
Highly Cited
1981
Highly Accelerated Temperature and Humidity Stress Test Technique (HAST)
A method for highly accelerated bias-temperature humidity stress testing is described. This method allows testing in the regime… 
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