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Highly accelerated stress test

Known as: HAST 
The highly accelerated stress test (HAST) method was invented by Nihal Sinnadurai while working as a Research Engineer at British Telecommunications… 
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Highly accelerated life testReliability engineering

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
The investigation of LED's reliability through highly accelerated stress testing methods
The white light emitting diode technology is developing rapidly in recent years. Evaluating the lifetime and failure rates of… 
2012
2012
Reliability challenges of Cu wire deployment in flash memory packaging
Cu wirebonding become a great interest of industry in recent years due to its cost effectiveness and electrical and mechanical… 
2010
2010
Reliability of palladium coated copper wire
Alternative solutions for Au wire are high in demand as a result of increasing gold price and high demand for lower cost packages… 
2010
2010
Investigation of Palladium Distribution on the Free Air Ball of Pd-coated Cu wire
The application of copper wire coated with Palladium is a solution to prevent copper oxidation during the bonding process. This… 
2009
2009
Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF
Flip chip packaging of ultra fine pitch integrated circuits (ICs) on organic substrates aggravates the stress-strain concerns… 
2008
2008
Effect of Non-Uniform Moisture Distribution on the Hygroscopic Swelling Coefficient
The coefficient of hygroscopic swelling is a material property used to measure the volumetric change with moisture absorption… 
Highly Cited
2007
Highly Cited
2007
Reliability of Cu Wire Bonding to Al Metallization
The use of Cu wire for thermosonic ball bonding presents several advantages over Au wire. These advantages include significant… 
2005
2005
Swelling and time-dependent subcritical debonding of underfill during temperature-humidity aging of flip chip packages
Stress corrosion cracking and the associated time-dependent subcritical debonding of the underfill-die interface is believed to… 
Highly Cited
2001
Highly Cited
2001
Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems
Review
2000
Review
2000
Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging
Transactions of the ASME, Journal of Electronic Packaging (ISSN 1043-7398) is published quarterly (March, June, Sept., Dec.) by… 
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