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Failure cause
Known as:
Component failure
, Failure mechanisms
, Mode of failure
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Failure causes are defects in design, process, quality, or part application, which are the underlying cause of a failure or which initiate a process…
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Related topics
Related topics
15 relations
Buckling
Cascading failure
Corner case
Debugging
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Broader (1)
Failure
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2006
Highly Cited
2006
Solder-joint reliability in electronics under shock and vibration using explicit finite-element sub-modeling
P. Lall
,
S. Gupte
,
P. Choudhary
,
J. Suhling
Electronic Components and Technology Conference
2006
Corpus ID: 21410467
In this paper, the modeling approaches for first-level solder interconnects in shock and drop of electronics assemblies have been…
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Highly Cited
2006
Highly Cited
2006
Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions
Toni T. Mattila
,
Pekka Marjamäki
,
J. Kivilahti
IEEE transactions on components and packaging…
2006
Corpus ID: 25384854
Failure modes and mechanisms under mechanical shock loading were studied by employing the statistical and fractographic research…
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Highly Cited
2001
Highly Cited
2001
Blunt and sharp notch behaviour of Glare laminates
T. D. Vries
2001
Corpus ID: 110929393
Glare laminates are materials that consist of alternating aluminium and glass prepreg layers especially designed for aeroplane…
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Highly Cited
2000
Highly Cited
2000
A case-based reasoning system for identifying failure mechanisms
T. Liao
,
Z. Zhang
,
C. R. Mount
2000
Corpus ID: 62634810
Review
1999
Review
1999
Design and development of a conformal load-bearing smart skin antenna: overview of the AFRL Smart Skin Structures Technology Demonstration (S3TD)
Allen J. Lockyer
,
Kevin H. Alt
,
+4 authors
J. Tuss
Smart Structures
1999
Corpus ID: 111015426
Documented herein is a review of progress for the recently completed 'Smart Skin Structure Technology Demonstration' (S3TD…
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Highly Cited
1990
Highly Cited
1990
MECHANICAL FRACTURE-BEHAVIOR OF POLYACETAL AND THERMOPLASTIC POLYURETHANE ELASTOMER TOUGHENED POLYACETAL
F. Chang
,
Mi-Yun Yang
1990
Corpus ID: 59482841
Polyacetal (POM) toughening with thermoplastic polyurethane (TPU) elastomer was investigated in terms of Theological, mechanical…
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Highly Cited
1986
Highly Cited
1986
Gate metallization "Sinking" into the active channel in Ti/W/Au metallized power MESFET's
C. Canali
,
F. Castaldo
,
F. Fantini
,
D. Ogliari
,
L. Umena
,
E. Zanoni
IEEE Electron Device Letters
1986
Corpus ID: 37797964
Commercial power MESFET's with Ti/W/Au gate metallization show a failure mode consisting of a decrease in Idssand Vpand an…
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Highly Cited
1981
Highly Cited
1981
Long-term and instantaneous burnout in GaAs power FET's: Mechanisms and solutions
S. H. Wemple
,
W.C. Niehous
,
+5 authors
W. Schlosser
IEEE Transactions on Electron Devices
1981
Corpus ID: 22946544
Catastrophic source-drain burnout is an important failure mode in GaAs power FET's. In this paper we show that short-term…
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Review
1978
Review
1978
Alpha particle tracks in silicon and their effect on dynamic MOS RAM reliability
J. T. Nelson
,
L. L. Vanskike
,
D. Yaney
International Electron Devices Meeting
1978
Corpus ID: 9156744
Recent investigations have found low levels of alpha radiation (< .1 counts/cm2-hour) emitted from the immediate chip environment…
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Review
1972
Review
1972
Failure criterion for brickwork in axial compression
C. Khoo
1972
Corpus ID: 112632176
The object of this thesis is to establish a failure criterion for brickwork in axial compression. Chapter 1 introduces the…
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