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Experimental Factor Ontology
Known as:
EFO
Experimental factor ontology, also known as EFO, is an open-access ontology of experimental variables particularly those used in molecular biology…
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7 relations
ChEBI
ChEMBL
ENCODE
Gene ontology
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2012
2012
Study of Pd mixing during Pd-Cu wire ball formation and impact on wire bond quality
Flynn Carson
,
J. Yee
,
Soo San Park
,
Edward Fontanilla
IEEE 62nd Electronic Components and Technology…
2012
Corpus ID: 25735268
The skyrocketing price of gold has driven the rapid adoption of copper wire in semiconductor packaging. Cu wire is being used for…
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2011
2011
Impact of palladium to the interfacial behavior of palladium coated copper wire on aluminium pad metallization during high temperature storage
D. Stephan
,
E. Chew
,
J. Yeung
,
E. Milke
IEEE 13th Electronics Packaging Technology…
2011
Corpus ID: 9541164
Reliability of palladium coated copper wire is believed to have enhancement over bare copper wire. With current understanding…
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2011
2011
An investigation into the crystallization and electric flame-off characteristics of 20 μm copper wires
F. Hung
,
T. Lui
,
Li-Hui Chen
,
H. Hsueh
Microelectronics and reliability
2011
Corpus ID: 206946602
2011
2011
A study on the tensile fracture mechanism of 15 μm copper wire after EFO process
I. Huang
,
F. Hung
,
T. Lui
,
Li-Hui Chen
,
H. Hsueh
Microelectronics and reliability
2011
Corpus ID: 21358885
2010
2010
Investigation of Palladium Distribution on the Free Air Ball of Pd-coated Cu wire
L. Tang
,
H. Ho
,
Yue-Jia Zhang
,
Yuet-Mun Lee
,
Che-Wei Lee
Electronic Packaging Technology Conference
2010
Corpus ID: 11577620
The application of copper wire coated with Palladium is a solution to prevent copper oxidation during the bonding process. This…
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2009
2009
Factors governing heat affected zone during wire bonding
Lining Sun
,
Yuetao Liu
,
Yanjie Liu
2009
Corpus ID: 67854073
2005
2005
Modeling energy transfer to copper wire for bonding in an inert environment
H. Ho
,
J. Tan
,
Yee Chen Tan
,
B. Toh
,
P. Xavier
Electronic Packaging Technology Conference
2005
Corpus ID: 35963015
Copper wire ball bonding has gained popularity in the last few years due to its economic advantage and superior electrical…
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2005
2005
Process optimization of gold stud bump manufacturing using artificial neural networks
L. Liau
,
Burce Shin-Ching Chen
Expert systems with applications
2005
Corpus ID: 21366917
Review
2000
Review
2000
The Function of the Laying on of Hands in the New Testament
John Fleter Tipei
2000
Corpus ID: 191020335
This study investigates the procedural techniques, significance and the tangible effects of the laying on of hands in the New…
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1998
1998
Evaluation of Database Modeling Methods for Geographic Information Systems
T. Hadzilacos
,
N. Tryfona
Australasian Journal of Information Systems
1998
Corpus ID: 12211449
We present a systematic evaluation of different modeling techniques for the design of Geographic Information Systems as we…
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