Endodontic underfill

 
National Institutes of Health

Topic mentions per year

Topic mentions per year

2004-2016
012320042016

Papers overview

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2016
2016
System-in-Package (SiP) is becoming more and more important in integrating functionality while reducing final product form… (More)
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2016
2016
System-in-Package (SiP) is becoming more and more important in integrating functionality while reducing final product form… (More)
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2016
2016
Recently, flip-chip assembly has become mainstream for fine-pitch interconnection in large-scale integration packages. Gold studs… (More)
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2015
2015
Thermocompression (TC) flip chip (FC) bonding enables packaging of the most advanced semiconductor devices by allowing finer… (More)
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2014
2014
Underfill materials protect electronic package interconnects. They are designed to bridge the thermal expansion behavior of die… (More)
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2012
2012
Advanced underfill material plays an important role in device reliability by distributing the thermal stress and providing… (More)
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2010
2010
The demand for flip chip devices is rising to meet increasingly strict requirements for smaller package size, multiple-die… (More)
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2010
2010
In present study, a backside-etched silicon chip with a polysilicon diaphragm flip-chip attached on a printed wiring board (PWB… (More)
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2009
2009
For advanced wafer-level chip scale packages (WLCSP), board level solder joint reliability is a major concern, and typical stress… (More)
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2004
2004
  • Jeffrey C. Suhlingl, Pradeep Lalll, Baohua Xuz, Wayne Johnson
  • 2004
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulanls for the purpose of… (More)
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