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Endodontic underfill

 
National Institutes of Health

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2012
2012
Glassy thermoset polymer underfills are commonly used for reliability enhancement in modern electronics. By adding filler to the… Expand
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2012
2012
In this work, the viscoelastic mechanical response of a typical underfill encapsulant has been characterized via rate dependent… Expand
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2010
2010
The demand for flip chip devices is rising to meet increasingly strict requirements for smaller package size, multiple-die… Expand
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2009
2009
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as… Expand
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2004
2004
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of… Expand
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2004
2004
This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride… Expand
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2004
2004
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of… Expand
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2003
2003
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulanls for the purpose of… Expand
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2001
2001
The last years have witnessed an explosive growing demand for all those electronic products, which can be jointly referred to as… Expand
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Highly Cited
2000
Highly Cited
2000
Finite element analyses (FEAs) have been widely used to preventively predict the reliability issues of flip-chip (FC) packages… Expand
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