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Endodontic underfill

National Institutes of Health

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Reliable, consistent, and comprehensive material property data are needed for microelectronics encapsulants for the purpose of… 
2012
2012
In this work, the viscoelastic mechanical response of a typical underfill encapsulant has been characterized via rate dependent… 
2012
2012
Glassy thermoset polymer underfills are commonly used for reliability enhancement in modern electronics. By adding filler to the… 
2009
2009
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as… 
2008
2008
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as… 
2005
2005
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of… 
2004
2004
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of… 
2004
2004
  • S. Luo, C. Wong
  • IEEE Transactions on Components and Packaging…
  • 2004
  • Corpus ID: 10692375
This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride… 
2003
2003
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulanls for the purpose of… 
Highly Cited
2000
Highly Cited
2000
Finite element analyses (FEAs) have been widely used to preventively predict the reliability issues of flip-chip (FC) packages…