Endodontic underfill
National Institutes of Health
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Glassy thermoset polymer underfills are commonly used for reliability enhancement in modern electronics. By adding filler to the…
In this work, the viscoelastic mechanical response of a typical underfill encapsulant has been characterized via rate dependent…
A backside-etched silicon chip with a polysilicon diaphragm flip-chip attached on a printed wiring board and globally bumped on a…
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as…
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as…
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of…
This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride…
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of…
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulanls for the purpose of…
Finite element analyses (FEAs) have been widely used to preventively predict the reliability issues of flip-chip (FC) packages…