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Endodontic underfill

 
National Institutes of Health

Papers overview

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2012
2012
Predicting the Effect of Underfill Filler Volume Fraction on Solder Fatigue Life and Residual Stress for Surface Mount Components Using Nonlinear Viscoelastic Analyses
Glassy thermoset polymer underfills are commonly used for reliability enhancement in modern electronics. By adding filler to the… Expand
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2012
2012
Impelementatoin of a viscoelastic model for the temperature dependent material behavior of underfill encapsulants
In this work, the viscoelastic mechanical response of a typical underfill encapsulant has been characterized via rate dependent… Expand
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2010
2010
Solder joint encapsulation and reliability using dippable underfill
The demand for flip chip devices is rising to meet increasingly strict requirements for smaller package size, multiple-die… Expand
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2009
2009
Isothermal aging induced evolution of the material behavior of underfill encapsulants
Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as… Expand
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2004
2004
Measurement of the temperature dependent constitutive behavior of underfill encapsulants
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of… Expand
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2004
2004
Moisture absorption in uncured underfill materials
This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride… Expand
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2004
2004
Measurement of the temperature dependent constitutive behavior of underfill encapsulants
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulants for the purpose of… Expand
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2003
2003
Measurements and modeling of the temperature dependent material behavior of underfill encapsulants
Reliable, consistent, and comprehensive material property data are needed for microelectronic encapsulanls for the purpose of… Expand
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2001
2001
Solder extrusions and underfill delaminations: a remarkable Flip Chip qualification experience
The last years have witnessed an explosive growing demand for all those electronic products, which can be jointly referred to as… Expand
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Highly Cited
2000
Highly Cited
2000
An improved methodology for determining temperature dependent moduli of underfill encapsulants
Finite element analyses (FEAs) have been widely used to preventively predict the reliability issues of flip-chip (FC) packages… Expand
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