Skip to search form
Skip to main content
Skip to account menu
Semantic Scholar
Semantic Scholar's Logo
Search 231,065,694 papers from all fields of science
Search
Sign In
Create Free Account
Encapsulation (networking)
Known as:
Upper layer protocol
, Encapsulation
, Lower layer protocol
Expand
In computer networking, encapsulation is a method of designing modular communication protocols in which logically separate functions in the network…
Expand
Wikipedia
(opens in a new tab)
Create Alert
Alert
Related topics
Related topics
26 relations
Adobe Flash Player
Audio over Ethernet
Datacasting
Datagram
Expand
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2013
Highly Cited
2013
Ultra-High Thermal-Stable Glass Phosphor Layer for Phosphor-Converted White Light-Emitting Diodes
Chun-Chin Tsai
,
W. Cheng
,
+4 authors
W. Cheng
Journal of Display Technology
2013
Corpus ID: 41430538
A glass phosphor layer with ultra-high thermal stability appropriate for phosphor-converted white light-emitting diodes (PC-WLEDs…
Expand
Highly Cited
2011
Highly Cited
2011
Modeling of a Liquid Epoxy Molding Process Using a Particle Swarm Optimization-Based Fuzzy Regression Approach
Kit Yan Chan
,
T. Dillon
,
C. Kwong
IEEE Transactions on Industrial Informatics
2011
Corpus ID: 12049581
Modeling of manufacturing processes is important because it enables manufacturers to understand the process behavior and…
Expand
Highly Cited
2011
Highly Cited
2011
Fully Passivated AlInN/GaN HEMTs With $f_{\rm T}/f_{\rm MAX}$ of 205/220 GHz
S. Tirelli
,
D. Marti
,
+4 authors
C. Bolognesi
IEEE Electron Device Letters
2011
Corpus ID: 30816346
We report the fabrication and characterization of 30-nm-gate fully passivated AlInN/GaN high-electron mobility transistors (HEMTs…
Expand
Highly Cited
2006
Highly Cited
2006
Nanowires with a carbon nanotube core and silicon oxide sheath
Jiangang Hu
,
Zhenxia Wang
,
+4 authors
Xiaofeng Duan
2006
Corpus ID: 51997050
Highly Cited
1999
Highly Cited
1999
Behavioral Specification of Distributed Software Component Interfaces
Cynthia Della Torre Cicalese
,
S. Rotenstreich
Computer
1999
Corpus ID: 13859238
Networked computers are finding their way into a broader range of environments, from corporate offices to schools, homes, and…
Expand
Review
1998
Review
1998
From Lindqvist and Keggin ions to electronically inverse hosts
M. Rohmer
,
M. Bénard
,
J. Blaudeau
,
J. Maestre
,
J. Poblet
1998
Corpus ID: 55308076
Highly Cited
1988
Highly Cited
1988
Techniques for preparing hydrogel membrane capsules
S. Nigam
,
I. Tsao
,
A. Sakoda
,
Henry Y. Wang
1988
Corpus ID: 67772935
Techniques for preparing four kinds of hydrogel membrane capsules are described. In the present process the material being…
Expand
Highly Cited
1985
Highly Cited
1985
Computer Aided Stress Modeling for Optimizing Plastic Package Reliability
S. Groothuis
,
W. Schroen
,
M. Murtuza
IEEE International Reliability Physics Symposium
1985
Corpus ID: 9337974
A computer-aided stress analysis program has been applied to reliability prediction of VLSI plastic packages. The process of…
Expand
Highly Cited
1985
Highly Cited
1985
The roles of the surface and bulk of the semi-insulating substrate in low-frequency anomalies of GaAs integrated circuits
S. Makram-Ebeid
,
P. Minondo
IEEE Transactions on Electron Devices
1985
Corpus ID: 21833365
We investigate in detail two anomalies in metal-semiconductor field-effect transistors (MESFET) which are detrimental to their…
Expand
Highly Cited
1981
Highly Cited
1981
MOSFET's on Silicon prepared by moving melt zone recrystallization of encapsulated polycrystalline Silicon on an insulating substrate
E. Maby
,
M. Geis
,
Y. Lecoz
,
D. Silversmith
,
R. Mountain
,
D. Antoniadis
IEEE Electron Device Letters
1981
Corpus ID: 32599932
We report a process for the recrystallization of thin silicon films on silicon dioxide that uses a composite encapsulation layer…
Expand
By clicking accept or continuing to use the site, you agree to the terms outlined in our
Privacy Policy
(opens in a new tab)
,
Terms of Service
(opens in a new tab)
, and
Dataset License
(opens in a new tab)
ACCEPT & CONTINUE