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Die shrink

Known as: Semiconductor scaling, 55 nanometer, 40 nanometer 
The term die shrink (sometimes optical shrink or process shrink) refers to a simple semiconductor scaling of semiconductor devices, mainly… 
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Related topics

Related topics

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Apple mobile application processorsArrandaleAthlonBaikal CPU

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
A 28 nm Embedded Split-Gate MONOS (SG-MONOS) Flash Macro for Automotive Achieving 6.4 GB/s Read Throughput by 200 MHz No-Wait Read Operation and 2.0 MB/s Write Throughput at Tj of 170$^{\circ}$ C
First-ever 28 nm embedded split-gate MONOS (SG-MONOS) flash macros have been developed to increase memory capacity embedded in… 
2015
2015
Steamroller Module and Adaptive Clocking System in 28 nm CMOS
This work describes the physical design implementation of the AMD “Steamroller” module and adaptive clocking system that are both… 
2015
2015
Alpha soft error rate of FDSOI 28 nm SRAMs: Experimental testing and simulation analysis
We report on soft error rate measurements on 28 nm commercial FDSOI SRAM bitcells under alpha irradiation. The technology proves… 
2015
2015
A 28-nm CMOS 7-GS/s 6-bit DAC With DfT Clock and Memory Reaching SFDR >50 dB Up to 1 GHz
This brief presents a 7-GS/s 6-bit current-steering digital-to-analog converter (DAC) in 28-nm CMOS for VLSI System On Chip I/O… 
2014
2014
Scalable 0.35 V to 1.2 V SRAM Bitcell Design From 65 nm CMOS to 28 nm FDSOI
This work presents a method for the design and characterization of a scalable ultra-wide voltage range static random access… 
2011
2011
Through-Silicon via Technology for 3D IC
Three-dimensional (3D) integration complements semiconductor scaling in enabling higher integration density as well as… 
Review
2011
Review
2011
Study on TSV with new filling method and alloy for advanced 3D-SiP
We focus on 3D-SiP using TSV's as one possible breakthrough method that can overcome semiconductor scaling limits. To this point… 
2008
2008
Die-to-database mask inspection with variable sensitivity
The cost of mask is increasing dramatically along with the continuous semiconductor scaling. ASET started a 4-year project to… 
Highly Cited
2003
Highly Cited
2003
New Millable Polyurethane/Organoclay Nanocomposite: Preparation, Characterization and Properties
Novel millable polyurethane (PU)/organoclay nanocomposites have been successfully prepared by conventional transformation… 
1999
1999
Preparation of zinc oxide-dispersed silver particles by spray pyrolysis of colloidal solution
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