Die (integrated circuit)

Known as: CPU Die, Die, Silicon die 
A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.Typically… (More)
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Highly Cited
2010
Highly Cited
2010
Three-dimensional (3D) interconnection technology offers several electrical advantages, including reduced signal delay, reduced… (More)
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Highly Cited
2009
Highly Cited
2009
One of the challenges for 3D technology adoption is the insufficient understanding of 3D testing issues and the lack of DFT… (More)
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Highly Cited
2006
Highly Cited
2006
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a… (More)
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Highly Cited
2006
Highly Cited
2006
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the… (More)
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Highly Cited
2005
Highly Cited
2005
Ich h~tte in meiner letzten, der XII. Mitteilung, ~usffihrlich dargetan, aus welchen Griinden ich meine frfihere Arbeitshypothese… (More)
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Highly Cited
2001
Highly Cited
2001
Fragestellung. Sowohl die Childhood Group der International Obesity Task Force (IOTF) als auch die European Childhood Obesity… (More)
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Highly Cited
1999
Highly Cited
1999
Our growing reliance on online services accessible on the Internet demands highly-available systems that provide correct service… (More)
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Highly Cited
1995
Highly Cited
1995
Transforming growth factor beta 1 (TGF beta 1) is shown here to be required for yolk sac haematopoiesis and endothelial… (More)
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Highly Cited
1986
Highly Cited
1986
This paper attempts to explain why innovating firms often fail to obtain significant economic returns from an innovation, while… (More)
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