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Composite epoxy material

Known as: Cem (disambiguation) 
Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined… 
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Related topics

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Printed circuit board

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Enhanced electrical and thermal performances of nanostructured epoxy/POSS composites
Epoxy resins modified with Glycidyl-POSS (Polyhedral Oligomeric Silsesquioxanes) in contents of up to 20 wt% were fabricated and… 
Review
2015
Review
2015
Health Care Workers Adherence to Infection Prevention Practices and Control Measures: A Case of a Level Four District Hospital in Kenya
Infection prevention practices and control are critical activities that influence the quality of health care services. This study… 
2013
2013
Adsorption of Heavy Metal Ion from Aqueous Single Metal Solution by Aminated Epoxy-Lignin
This study investigated the adsorption of the heavy-metal ions Cu(II) and Pb(II) onto a lignin derivative. The lignin derivative… 
2009
2009
Wafer level embedding technology for 3D wafer level embedded package
This paper presents the development of wafer level embedding process for a three dimensional (3D) embedded micro wafer level… 
Highly Cited
2008
Highly Cited
2008
One-Component, Low-Temperature, and Fast Cure Epoxy Encapsulant With High Refractive Index for LED Applications
The cationic polymerization of diglycidyl ether of bisphenol-A (DGEBA) using a latent cationic thermal initiator, ammonium… 
2008
2008
Normal Zone Propagation in 2-Dimensional YBCO Winding Pack Models
This paper presents the results of a study of 2-dimensional normal zone propagation (NZP) in winding pack models comprised of 12… 
2008
2008
Synthesis and Characterization of a POSS-Maleimide Precursor for Hybrid Nanocomposites
Epoxy polyhedral oligomeric silsesquioxane (POSS)-based hybrid nanocomposites were prepared by in situ polymerization of a… 
2005
2005
Flow time measurements for underfills in flip-chip packaging
Flow time is a key material property for underfill materials in flip-chip applications. In this paper, we will discuss how to use… 
2004
2004
Low-velocity impact of sandwich composite plates
In this paper we investigate impact and compression after impact properties of plain weave carbon fiber sandwich composites… 
1983
1983
Two Decades of Experience and Progress in Epoxy Mica Insulation Systems For Large Rotating Machines
After a brief discussion of the design and manufacturing of a vacuum-impregnated epoxy resin mica insulation system for turbine… 
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