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Composite epoxy material
Known as:
Cem (disambiguation)
Composite epoxy materials (CEM) are a group of composite materials typically made from woven glass fabric surfaces and non-woven glass core combined…
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Related topics
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Printed circuit board
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Enhanced electrical and thermal performances of nanostructured epoxy/POSS composites
T. Heid
,
M. Frechette
,
É. David
IEEE transactions on dielectrics and electrical…
2016
Corpus ID: 37206564
Epoxy resins modified with Glycidyl-POSS (Polyhedral Oligomeric Silsesquioxanes) in contents of up to 20 wt% were fabricated and…
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2012
2012
Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers
M. Ni
,
Ming Li
,
D. Mao
Microelectronics and reliability
2012
Corpus ID: 34642779
2009
2009
Wafer level embedding technology for 3D wafer level embedded package
Aditya Kumar
,
Xiao Dingwei
,
+7 authors
D. Kwong
Electronic Components and Technology Conference
2009
Corpus ID: 7240525
This paper presents the development of wafer level embedding process for a three dimensional (3D) embedded micro wafer level…
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Highly Cited
2008
Highly Cited
2008
One-Component, Low-Temperature, and Fast Cure Epoxy Encapsulant With High Refractive Index for LED Applications
Yan Zhou
,
N. Tran
,
Yuan-Chang Lin
,
Yongzhi He
,
F. Shi
IEEE Transactions on Advanced Packaging
2008
Corpus ID: 683806
The cationic polymerization of diglycidyl ether of bisphenol-A (DGEBA) using a latent cationic thermal initiator, ammonium…
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2008
2008
Synthesis and Characterization of a POSS-Maleimide Precursor for Hybrid Nanocomposites
Seetharaman Jothibasu
,
S. Premkumar
,
M. Alagar
,
I. Hamerton
2008
Corpus ID: 93484221
Epoxy polyhedral oligomeric silsesquioxane (POSS)-based hybrid nanocomposites were prepared by in situ polymerization of a…
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2005
2005
Flow time measurements for underfills in flip-chip packaging
Jinlin Wang
IEEE transactions on components and packaging…
2005
Corpus ID: 40282560
Flow time is a key material property for underfill materials in flip-chip applications. In this paper, we will discuss how to use…
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2004
2004
Low-velocity impact of sandwich composite plates
J. Gustin
,
M. Mahinfalah
,
G. N. Jazar
,
M. Aagaah
2004
Corpus ID: 6001886
In this paper we investigate impact and compression after impact properties of plain weave carbon fiber sandwich composites…
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2004
2004
Clumping and Packing of Hair Arrays Manufactured by Nanocasting
C. Majidi
,
R. Groff
,
R. Fearing
2004
Corpus ID: 9817195
The gecko’s remarkable dry adhesive system, consisting of arrays of heirarchically stuctured hairs made from a stiff material…
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2000
2000
Surface and line-edge roughness in solution and plasma developed negative tone resists: Experiment and simulation
G. Patsis
,
A. Tserepi
,
I. Raptis
,
N. Glezos
,
E. Gogolides
,
E. Valamontes
2000
Corpus ID: 55027786
A methodology is described for the experimental and theoretical study of surface roughness (SR) and line-edge roughness (LER) and…
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1983
1983
Two Decades of Experience and Progress in Epoxy Mica Insulation Systems For Large Rotating Machines
A. Wichmann
IEEE Transactions on Power Apparatus and Systems
1983
Corpus ID: 2148026
After a brief discussion of the design and manufacturing of a vacuum-impregnated epoxy resin mica insulation system for turbine…
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