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C++Builder
Known as:
Builder
, C plus plus builder
, Borland C++ Builder
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C++Builder is a rapid application development (RAD) environment, originally developed by Borland and as of 2009 owned by Embarcadero Technologies…
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Related topics
40 relations
Advantage Database Server
Ajax (programming)
Android
Borland Database Engine
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
Maternal nutrition affects the composition of follicular fluid and transcript content in gilt oocytes
E. Warzych
,
A. Cieślak
,
P. Pawlak
,
N. Renska
,
E. Pers-kamczyc
,
D. Lechniak
2018
Corpus ID: 30796618
Metabolomics focused on reproduction have been the subject of special interest in the past decade. Metabolite profiling provides…
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2014
2014
20 nm Metamorphic HEMT technology for terahertz monolithic integrated circuits
A. Leuther
,
A. Tessmann
,
+5 authors
O. Ambacher
European Microwave Integrated Circuits Conference
2014
Corpus ID: 14881229
A metamorphic high electron mobility transistor (mHEMT) technology with 20 nm gate length for manufacturing of terahertz…
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Highly Cited
2009
Highly Cited
2009
Poly(brilliant cresyl blue) modified glassy carbon electrodes: Electrosynthesis, characterisation and application in biosensors
M. Ghica
,
C. Brett
2009
Corpus ID: 97633589
2009
2009
A New Junction Termination Using a Deep Trench Filled With BenzoCycloButene
L. Théolier
,
H. Mahfoz-Kotb
,
K. Isoird
,
F. Morancho
,
S. Assié-Souleille
,
N. Mauran
IEEE Electron Device Letters
2009
Corpus ID: 44183485
A new junction termination for high-voltage devices using a deep trench filled with dielectric, which dramatically decreases the…
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Highly Cited
2008
Highly Cited
2008
Development of 3D silicon module with TSV for system in packaging
N. Khan
,
V. S. Rao
,
+5 authors
L. Ebin
Electronic Components and Technology Conference
2008
Corpus ID: 40004399
Portable electronic products demand multifunctional module comprising digital, RF and memory functions. Through-silicon via…
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2007
2007
Design, Fabrication, and Measurement of Benzocyclobutene Polymer Zero-Level Packaging for Millimeter-Wave Applications
S. Seok
,
N. Rolland
,
P. Rolland
IEEE transactions on microwave theory and…
2007
Corpus ID: 12210671
This paper presents a whole benzocyclobutene (BCB) membrane zero-level packaging using a wafer-level BCB bonding technique and a…
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Highly Cited
2006
Highly Cited
2006
Modeling Thermal Stresses in 3-D IC Interwafer Interconnects
Jing Zhang
,
M. Bloomfield
,
Jian-Qiang Lu
,
R. Gutmann
,
T. Cale
IEEE transactions on semiconductor manufacturing
2006
Corpus ID: 8741567
We present a finite-element-based analysis to determine if there are potential reliability concerns due to thermally induced…
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2004
2004
A highly integrated millimeter-wave active antenna array using BCB and silicon substrate
R. Carrillo-Ramirez
,
R. Jackson
IEEE transactions on microwave theory and…
2004
Corpus ID: 14660580
A simple and inexpensive packaging scheme is implemented in the design of an active antenna array module. The package consists of…
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2002
2002
Variable‐frequency microwave curing of benzocyclobutene
R. Tanikella
,
S. Allen
,
P. Kohl
2002
Corpus ID: 56068145
Polymer dielectrics are widely used in the microelectronics industry for several applications including interlevel dielectrics…
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Highly Cited
2001
Highly Cited
2001
Use of superswelling acrylamide/maleic acid hydrogels for monovalent cationic dye adsorption
Dursun Saraydın
,
E. Karadağ
,
O. Güven
2001
Corpus ID: 13693840
Acrylamide/maleic acid (AAm/MA) superswelling hydrogels prepared by irradiation with γ radiation were used in experiments on…
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