A highly integrated millimeter-wave active antenna array using BCB and silicon substrate

Abstract

A simple and inexpensive packaging scheme is implemented in the design of an active antenna array module. The package consists of etched wells in a silicon wafer in which the components of the module are placed. A benzocyclobutene (BCB) film covers the components and serves as a substrate for interconnections. Prefabricated metallic bumps on the components… (More)

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