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Black's equation

Known as: Black equation 
Black's Equation is a mathematical model for the mean time to failure (MTTF) of a semiconductor circuit due to electromigration: a phenomenon of… 
Wikipedia

Related topics

Related topics

2 relations
Electromigration

Broader (1)

Electronic design automation

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
PGIREM: Reliability-Constrained IR Drop Minimization and Electromigration Assessment of VLSI Power Grid Networks Using Cooperative Coevolution
Due to the resistance of metal wires in power grid network, voltage drop noise occurs in the form of IR drop which may change the… 
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2017
2017
Thermo-electric coupling reliability model of copper pillar bump based on Black equation
In order to investigate the reliability of micro-interconnecting copper pillar bump under thermal-electric coupling, the test… 
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2011
2011
Analysis of critical-length data from Electromigration failure studies
  • V. Dwyer
  • Microelectron. Reliab.
  • 2011
  • Corpus ID: 27096642
Abstract An accurate estimation of the Blech length, the critical line length below which interconnect lines are immortal, is… 
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2011
2011
Black's equation for today's ULSI interconnect Electromigration reliability — A revisit
  • W. Li, C. Tan
  • IEEE International Conference of Electron Devices…
  • 2011
  • Corpus ID: 20223701
Electromigration (EM) is an important failure mechanism in Ultra-Large-Scale Integration (ULSI) interconnections. The Black's… 
Review
2010
Review
2010
Physically based models of electromigration: From Black's equation to modern TCAD models
Electromigration failure is a major reliability concern for integrated circuits. The continuous shrinking of metal line… 
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2008
2008
Effects of length scaling on electromigration in dual-damascene copper interconnects
Abstract The electromigration short-length effect in dual-damascene Cu interconnects has been investigated through experiments on… 
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2005
2005
Lead-Free and PbSn Bump Electromigration Testing
As the electronics industry continues to push for miniaturization, several reliability factors become vital issues. The demand… 
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Highly Cited
2005
Highly Cited
2005
Current crowding effect on copper dual damascene via bottom failure for ULSI applications
Reliability of interconnect via is increasing an important issue in submicron technology. Electromigration experiments are… 
1999
1999
Temperature gradient effects in electromigration using an extended transition probability model and temperature gradient free tests. I. Transition probability model
Temperature gradient effects incorporated in electromigration are examined via the movement of vacancies. To explain the movement… 
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1979
1979
Job Change Behavior in the Rural Income Maintenance Experiment. Institute for Research on Poverty Discussion Papers.
kindly commented on an earlier draft. A considerable debt is owed to Professor Seymour Spi1erman for the· gUidance provided by a… 
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