Black's equation

Known as: Black equation 
Black's Equation is a mathematical model for the mean time to failure (MTTF) of a semiconductor circuit due to electromigration: a phenomenon of… (More)
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Papers overview

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2017
2017
In order to investigate the reliability of micro-interconnecting copper pillar bump under thermal-electric coupling, the test… (More)
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2015
2015
Through silicon vias (TSVs) are innovative interconnects which provide wider functionality and higher performance per unit area… (More)
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2013
2013
Reliability issues significantly limit performance improvements from Moore's-Law scaling. At 45nm and below, electromigration (EM… (More)
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2012
2012
In this paper we describe measurements of electromigration failure times in the metal traces of silicon Integrated Passive… (More)
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2011
2011
Electromigration (EM) is an important failure mechanism in Ultra-Large-Scale Integration (ULSI) interconnections. The Black's… (More)
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2011
2011
Failures due to Electromigration (EM) in flip-chip bumps have emerged as a major reliability concern due to potential elimination… (More)
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Review
2010
Review
2010
Electromigration failure is a major reliability concern for integrated circuits. The continuous shrinking of metal line… (More)
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2008
2008
The electromigration short-length effect in dual-damascene Cu interconnects has been investigated through experiments on lines of… (More)
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2005
2005
As the electronics industry continues to push for miniaturization, several reliability factors become vital issues. The demand… (More)
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2005
2005
We examine electromigration fatigue reliability and morphological patterns of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite… (More)
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