Black's equation

Known as: Black equation 
Black's Equation is a mathematical model for the mean time to failure (MTTF) of a semiconductor circuit due to electromigration: a phenomenon of… (More)
Wikipedia

Related topics

Related topics

2 relations
Electromigration

Broader (1)

Electronic design automation

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Thermo-electric coupling reliability model of copper pillar bump based on Black equation
In order to investigate the reliability of micro-interconnecting copper pillar bump under thermal-electric coupling, the test… (More)
  • table I
  • figure 4
  • figure 5
Is this relevant?
2015
2015
Analysis of electromigration void nucleation failure time in open copper TSVs
Through silicon vias (TSVs) are innovative interconnects which provide wider functionality and higher performance per unit area… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 7
Is this relevant?
2013
2013
On potential design impacts of electromigration awareness
Reliability issues significantly limit performance improvements from Moore's-Law scaling. At 45nm and below, electromigration (EM… (More)
  • figure 1
  • figure 2
  • figure 3
  • table II
  • figure 4
Is this relevant?
2012
2012
Electromigration measurements in thin-film IPD and eWLB interconnections
In this paper we describe measurements of electromigration failure times in the metal traces of silicon Integrated Passive… (More)
  • figure 1
  • table 1
  • figure 2
  • figure 4
  • figure 3
Is this relevant?
2011
2011
Black's equation for today's ULSI interconnect Electromigration reliability — A revisit
Electromigration (EM) is an important failure mechanism in Ultra-Large-Scale Integration (ULSI) interconnections. The Black's… (More)
Is this relevant?
2011
2011
Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps
Failures due to Electromigration (EM) in flip-chip bumps have emerged as a major reliability concern due to potential elimination… (More)
  • figure 1
  • figure 2
  • table 1
  • figure 3
  • table 2
Is this relevant?
Review
2010
Review
2010
Physically based models of electromigration: From Black's equation to modern TCAD models
Electromigration failure is a major reliability concern for integrated circuits. The continuous shrinking of metal line… (More)
  • figure 1
  • figure 2
  • table 1
  • figure 3
  • figure 5
Is this relevant?
2008
2008
Effects of length scaling on electromigration in dual-damascene copper interconnects
The electromigration short-length effect in dual-damascene Cu interconnects has been investigated through experiments on lines of… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2005
2005
Lead-Free and PbSn Bump Electromigration Testing
As the electronics industry continues to push for miniaturization, several reliability factors become vital issues. The demand… (More)
  • figure 2
  • table 1
  • figure 1
  • figure 3
  • figure 4
Is this relevant?
2005
2005
Electromigration reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
We examine electromigration fatigue reliability and morphological patterns of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite… (More)
  • figure 1
  • figure 2
  • figure 4
  • figure 5
  • table I
Is this relevant?