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Black's equation

Known as: Black equation 
Black's Equation is a mathematical model for the mean time to failure (MTTF) of a semiconductor circuit due to electromigration: a phenomenon of… 
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Related topics

Related topics

2 relations
Electromigration

Broader (1)

Electronic design automation

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
PGIREM: Reliability-Constrained IR Drop Minimization and Electromigration Assessment of VLSI Power Grid Networks Using Cooperative Coevolution
Due to the resistance of metal wires in power grid network, voltage drop noise occurs in the form of IR drop which may change the… 
2017
2017
Thermo-electric coupling reliability model of copper pillar bump based on Black equation
In order to investigate the reliability of micro-interconnecting copper pillar bump under thermal-electric coupling, the test… 
2017
2017
Electromigration behavior in aluminum wires for power base-station applications
In this paper, a study on electromigration in aluminum bond wires as used in power base station application is presented… 
2012
2012
Electromigration measurements in thin-film IPD and eWLB interconnections
In this paper we describe measurements of electromigration failure times in the metal traces of silicon Integrated Passive… 
2011
2011
Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps
Failures due to Electromigration (EM) in flip-chip bumps have emerged as a major reliability concern due to potential elimination… 
2007
2007
Unusual fluorescence emission characteristics from europium-doped lead phosphate glass caused by 3 MeV proton irradiation
In 1951, Birks and Black showed experimentally that the fluorescence efficiency of anthracene bombarded by alphas varies with… 
Highly Cited
2005
Highly Cited
2005
Current crowding effect on copper dual damascene via bottom failure for ULSI applications
Reliability of interconnect via is increasing an important issue in submicron technology. Electromigration experiments are… 
2005
2005
Electromigration reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
We examine electromigration fatigue reliability and morphological patterns of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite… 
1999
1999
Temperature gradient effects in electromigration using an extended transition probability model and temperature gradient free tests. I. Transition probability model
Temperature gradient effects incorporated in electromigration are examined via the movement of vacancies. To explain the movement… 
1979
1979
Job Change Behavior in the Rural Income Maintenance Experiment. Institute for Research on Poverty Discussion Papers.
kindly commented on an earlier draft. A considerable debt is owed to Professor Seymour Spi1erman for the· gUidance provided by a… 
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