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Background debug mode interface
Known as:
BDM
Background debug mode (BDM) interface is an electronic interface that allows debugging of embedded systems. Specifically, it provides in-circuit…
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Related topics
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9 relations
Breakpoint
Debugger
Debugging
Embedded system
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Energy-Efficient Distributed Compressed Sensing Data Aggregation for Cluster-Based Underwater Acoustic Sensor Networks
Deqing Wang
,
Ru Xu
,
Xiaoyi Hu
,
Wei Su
Int. J. Distributed Sens. Networks
2016
Corpus ID: 12664993
Energy-efficient data aggregation is important for underwater acoustic sensor networks due to its energy constrained character…
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2015
2015
Edge detection with fuzzy cellular automata transition function optimized by PSO
S. Uguz
,
U. Sahin
,
F. Sahin
Computers & electrical engineering
2015
Corpus ID: 32884259
2010
2010
Numerical analysis and implementational aspects of a new multilevel grid deformation method
Matthias Grajewski
,
M. Köster
,
S. Turek
2010
Corpus ID: 17203235
2010
2010
Dissecting Galaxy Formation: II. Comparing Substructure in Pure Dark Matter and Baryonic Models
E. Romano-Díaz
,
I. Shlosman
,
C. Heller
,
Y. Hoffman
2010
Corpus ID: 119209072
We compare the substructure evolution in pure dark matter (DM) halos with those in the presence of baryons (PDM and BDM). The…
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2009
2009
Fixed-Size LS-SVM Applied to the Wiener-Hammerstein Benchmark
K. Brabanter
,
P. Dreesen
,
+4 authors
B. Moor
2009
Corpus ID: 110681919
Abstract This paper reports on the application of Fixed-Size Least Squares Support Vector Machines (FS-LSSVM) for the…
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2007
2007
Investigating the Number of Non-linear and Multi-modal Relationships Between Observed Variables Measuring Growth-oriented Atmosphere
P. Nokelainen
,
T. Silander
,
P. Ruohotie
,
H. Tirri
2007
Corpus ID: 6603562
This study investigates the number of non-linear and multi-modal relationships between observed variables measuring the Growth…
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2006
2006
Height Inspection of Wafer Bumps Without Explicit 3-D Reconstruction
Mei Dong
,
R. Chung
,
Yang Zhao
,
E. Lam
IEEE transactions on electronics packaging…
2006
Corpus ID: 21922587
Die bonding in the semiconductor industry requires placement of solder bumps not on PCBs but on wafers. Such wafer bumps, which…
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1999
1999
Evaluating the fault tolerance capabilities of embedded systems via BDM
M. Rebaudengo
,
M. Reorda
Proceedings of the ... IEEE VLSI Test Symposium
1999
Corpus ID: 37096847
Fault injection is a viable solution for verifying the correct design and implementation of fault tolerance mechanisms at…
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1996
1996
High temperature resins based on allylamine/bismaleimides
King-Fu Lin
,
Jin-Sing Lin
,
Chen-Hwa Cheng
1996
Corpus ID: 53378787
1995
1995
Mixed Finite Element Approximation of Darcy's Law in Porous Media
itSTEFANO MANTICAReservoir
,
Via Emilia
,
S. Milanese
1995
Corpus ID: 17091861
A mixed nite element formulation for eeciently computing the velocity eld for uid ows in porous media is presented. Raviart…
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