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Silicon wafer with high surface quality is widely used as substrate materials in the fields of micromachines and microelectronics… Expand Figure 1. Schematic diagram of the double insulated carbonisation-activation reactor system. he demand of activated carbon is… Expand The aim of this study was to compare surface roughness and gloss of resin composites polished using different polishing systems… Expand Due to the radical compromise in thermal and/or mechanical properties that the migration from silicon dioxide to novel low-k… Expand We present a process for the void-free filling of sub-100 nm trenches with copper or copper-manganese alloy by chemical vapor… Expand A Reynolds equation that considers both the smoothing hydrodynamic pressure and the pattern of surface topography at the… Expand A new bumping process on a Si die by electroplating without a photo-resist-mold (PRM) was assessed for the three dimensional (3D… Expand PURPOSE
The purpose of this in vitro study was to determine the effects of six surface treatment methods on the surface roughness… Expand A full-scale intensive pond system (IPS) with shorter HRT was designed, constructed and operated in Jining, Inner-Mongolia for… Expand The purpose of this study is to assess what impact shortening disclusion time to less than .5 seconds during right and left… Expand