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bumps lip

Known as: bump lip, bumps lips, lip bump 
National Institutes of Health

Papers overview

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2019
2019
Evolution of the gravity offset of mixed modes in RGB stars
Context.Observations of mixed modes in evolved low-mass stars enable us to probe the properties of not only the outer envelope of… 
2016
2016
High-order output-based adaptive simulations of turbulent flow over a three dimensionsional bump
This paper presents output-based high-order adaptive simulations of a threedimensional benchmark problem for turbulence model… 
2014
2014
Interconnect reliability prediction for wafer level packages (WLP) for temperature cycle and drop load conditions
Interconnect reliability of wafer level packages (WLP) is one of the major concerns because of the direct connection of die to… 
2011
2011
BEAM-INDUCED QUENCH TEST OF A LHC MAIN QUADRUPOLE
Unexpected beam loss might lead to a transition of the accelerator superconducting magnet to a normal conducting state. The LHC… 
2007
2007
Demonstration of BOC ( 15 , 2 . 5 ) acquisition and tracking with a prototype hardware receiver
Stephen Hodgart received a Ph.D. degree from the University of Surrey. He has been with the Surrey Space Centre, since its… 
2007
2007
Study of emittance bumps in the ILC main linac
We present a first look at simulation results of emittance bumps implemented to preserve the emittance growth in the main linac… 
2005
2005
Information display by dragged haptic bumps
The utility of haptic interfaces is widely established now. Although many interfaces has been designed, few tests about immediate… 
2005
2005
Tin bumping for wafer level lead-free packaging
A pure tin bumping technology is described in this paper. TiW/Cu was used as under bump metallurgy. The pure tin was… 
2004
2004
On the Relationship between the Optical Emission-Line and X-Ray Luminosities in Seyfert 1 Galaxies
We have explored the relationship between the [O III] λ5007 and the 2-10 keV luminosities for a sample of broad- and narrow-line… 
2004
2004
Effect of Plasma Cleaning on Fluxless Plasma Soldering of Pb-free Solder Balls on Si-wafer
An Ar-10 vol%H2 plasma was applied as a cleaning medium on UBMs (Under Bump Metallizations) to improve the bondability of solder… 
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