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YPbPr
Known as:
Y'PbPr
, Component Video Connector
, Y Pb Pr
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YPBPR is a color space used in video electronics, in particular in reference to component video cables. YPBPR is the analog version of the YCBCR…
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Related topics
Related topics
41 relations
576i
AMD 690 chipset series
Allwinner A1X
Analog signal
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Broader (1)
Color space
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2017
Highly Cited
2017
Deep Learning with Domain Adaptation for Accelerated Projection Reconstruction MR
Yoseob Han
,
J. Yoo
,
J. C. Ye
arXiv.org
2017
Corpus ID: 351027
Purpose: The radial k-space trajectory is a well-established sampling trajectory used in conjunction with magnetic resonance…
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2015
2015
A strategy for cross-calibrating U-Pb chronology and astrochronology of sedimentary sequences: An example from the Green River Formation, Wyoming, USA
M. Machlus
,
J. Ramezani
,
S. Bowring
,
S. Hemming
,
K. Tsukui
,
W. Clyde
2015
Corpus ID: 128693860
2015
2015
Very high-energyγ-ray observations of novae and dwarf novae with the MAGIC telescopes
M. L. Ahnen
,
S. Ansoldi
,
+258 authors
Nasa Goddard Space Flight Center
Astronomy & Astrophysics
2015
Corpus ID: 3530651
Context. In the last five years the Fermi Large Area Telescope (LAT) instrument detected GeV-ray emission from five novae. The…
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2014
2014
Theoretical foundation of passive bistatic ISAR imaging
M. Martorella
,
E. Giusti
IEEE Transactions on Aerospace and Electronic…
2014
Corpus ID: 19794116
Passive bistatic inverse synthetic aperture radar (PB-ISAR) has been recently introduced to add an important capability to…
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Highly Cited
2013
Highly Cited
2013
Wideband Channel Modeling and Intercarrier Interference Cancellation for Vehicle-to-Vehicle Communication Systems
Xiang Cheng
,
Qi Yao
,
Miaowen Wen
,
Chengxiang Wang
,
Lingyang Song
,
B. Jiao
IEEE Journal on Selected Areas in Communications
2013
Corpus ID: 17546644
In this paper, we propose a new regular-shaped geometry-based stochastic model (RS-GBSM) for non-isotropic scattering wideband…
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Review
2012
Review
2012
Development of high-temperature solders: Review
G. Zeng
,
S. McDonald
,
K. Nogita
Microelectronics and reliability
2012
Corpus ID: 16614462
2011
2011
Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys With Minor Pb Additions
M. Collins
,
J. Punch
,
+4 authors
D. Fleming
IEEE Transactions on Components, Packaging, and…
2011
Corpus ID: 42155999
The thermal fatigue performances of Sn<sub>98.5</sub>Ag<sub>1.0</sub>Cu<sub>0.5</sub> (SAC105), Sn<sub>97.5</sub>Ag<sub>2.0</sub…
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Highly Cited
2010
Highly Cited
2010
Geochemical contrasts between early Cretaceous ore-bearing and ore-barren high-Mg adakites in central-eastern China: Implications for petrogenesis and Cu–Au mineralization
Sheng‐Ao Liu
,
Shuguang Li
,
Yongsheng He
,
F. Huang
2010
Corpus ID: 73625509
2009
2009
Analysis of the mechanical behavior, microstructure, and reliability of mixed formulation solder joints
Yifei Zhang
,
Kanth Kurumaddali
,
J. Suhling
,
P. Lall
,
M. Bozack
Electronic Components and Technology Conference
2009
Corpus ID: 20102490
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past…
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Highly Cited
2004
Highly Cited
2004
Effect of volume in interfacial reaction between eutectic Sn-Pb solder and Cu metallization in microelectronic packaging
A. Sharif
,
Y. Chan
,
R. Islam
2004
Corpus ID: 44048267
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