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Thermal Head
The Thermal Head is a component of a metrological device created to aid in development of new CPUs and chipsets. The first Thermal Head was…
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Related topics
3 relations
Broader (1)
Central processing unit
Chipset
Slot 1
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2015
Highly Cited
2015
Treatment of RO brine from CSG produced water by spiral-wound air gap membrane distillation — A pilot study
H. C. Duong
,
Allan R. Chivas
,
+4 authors
L. D. Nghiem
2015
Corpus ID: 52440075
Abstract Brine management is a major bottleneck for coal seam gas (CSG) production in Australia. This study investigated the…
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Highly Cited
2010
Highly Cited
2010
Reducing Cross-Coupling in a Compliant XY Nanopositioner for Fast and Accurate Raster Scanning
Y. Yong
,
Kexiu Liu
,
S. Moheimani
IEEE Transactions on Control Systems Technology
2010
Corpus ID: 1509951
A compliant XY nanopositioner is presented in this brief. The device is designed to have a very low cross-coupling between the X…
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Highly Cited
2007
Highly Cited
2007
Empirical model of the Io plasma torus: Voyager measurements
Fr•n B•genM
2007
Corpus ID: 109927153
We present • description of pl•sm• conditions in the Io pl•sm• torus, between 5 •nd 10 R•, based on Voyager i observations…
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Highly Cited
2005
Highly Cited
2005
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
A. Ajami
,
K. Banerjee
,
Massoud Pedram
IEEE Transactions on Computer-Aided Design of…
2005
Corpus ID: 17332947
Nonuniform thermal profiles on the substrate in high-performance ICs can significantly impact the performance of global on-chip…
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Highly Cited
2004
Highly Cited
2004
Determination of the soot absorption function and thermal accommodation coefficient using low-fluence LII in a laminar coflow ethylene diffusion flame
D. Snelling
,
Fengshan Liu
,
G. J. Smallwood
,
Ö. Gülder
2004
Corpus ID: 4656463
Effective temperatures of pulsed-laser-heated soot particles were derived from their thermal emission intensities using optical…
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2004
2004
The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints
Sung K. Kang
,
P. Lauro
,
+8 authors
Won Kyoung Choi
2004
Corpus ID: 56072194
The electronic industry is making substantial progress toward a full transition to Pb-free soldering in the near future. At…
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Highly Cited
2003
Highly Cited
2003
Application of infrared thermography to the non-destructive testing of concrete and masonry bridges
M. R. Clark
,
D. McCann
,
M. Forde
2003
Corpus ID: 7148254
Abstract Within recent years there has been an increase in the use of NDT methods to detect defects and anomalies in various…
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Highly Cited
2003
Highly Cited
2003
An experimental technique for the measurement of temperature fields for the orthogonal cutting in high speed machining
G. Sutter
,
L. Fauré
,
A. Molinari
,
N. Ranc
,
V. Pina
2003
Corpus ID: 84180292
Cutting temperature and heat generated at the tool-chip interface during high speed machining operations have been recognized as…
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Highly Cited
2002
Highly Cited
2002
Modeling the thermal behavior of a surface-micromachined linear-displacement thermomechanical microactuator
C. Lott
,
T. McLain
,
J. Harb
,
L. L. Howell
2002
Corpus ID: 55567327
Thermomechanical microactuators possess a number of desirable attributes including ease of fabrication and large force and…
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Highly Cited
2001
Highly Cited
2001
A mechanistic study of oxidation-induced degradation in a plasma-sprayed thermal barrier coating system.: Part II: Life prediction model
E. Busso
,
J. Lin
,
S. Sakurai
2001
Corpus ID: 76650371
A parametric study is conducted to quantify the effects of different microstructural variables and service conditions on the…
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