Thermal Head

The Thermal Head is a component of a metrological device created to aid in development of new CPUs and chipsets. The first Thermal Head was… (More)
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Central processing unit
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Papers overview

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2015
2015
3DVLSI with CoolCube process: An alternative path to scaling
3D VLSI with a CoolCube™ integration allows vertically stacking several layers of devices with a unique connecting via density… (More)
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Highly Cited
2013
Highly Cited
2013
A Flexible and Robust Large Scale Capacitive Tactile System for Robots
Capacitive technology allows building sensors that are small, compact and have high sensitivity. For this reason it has been… (More)
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Highly Cited
2010
Highly Cited
2010
Reducing Cross-Coupling in a Compliant XY Nanopositioner for Fast and Accurate Raster Scanning
A compliant XY nanopositioner is presented in this brief. The device is designed to have a very low cross-coupling between the X… (More)
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2006
2006
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system… (More)
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2006
2006
THERMAL RADIATION INTERACTION WITH UNSTEADY MHD FLOW PAST A VERTICAL POROUS PLATE IMMERSED IN A POROUS MEDIUM
Abstract A study of unsteady MHD free convection flow through a porous vertical flat plate immersed in a porous medium in… (More)
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Highly Cited
2005
Highly Cited
2005
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
Nonuniform thermal profiles on the substrate in high-performance ICs can significantly impact the performance of global on-chip… (More)
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2004
2004
Thermal fatigue modelling for SnAgCu and SnPb solder joints
Thermal fatigue of solder joints is investigated by means of the finite element method (FEM). During the usual thermal cycle… (More)
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2004
2004
Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder joints
In this work, thermal cycling reliability test and analysis for PBGA components with Sn-3.8Ag-0.7Cu solder joints were… (More)
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Highly Cited
2003
Highly Cited
2003
Application of infrared thermography to the non-destructive testing of concrete and masonry bridges
Within recent years there has been an increase in the use of NDT methods to detect defects and anomalies in various civil… (More)
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2003
2003
An experimental technique for the measurement of temperature fields for the orthogonal cutting in high speed machining
HAL is a multi-disciplinary open access archive for the deposit and dissemination of scientific research documents, whether they… (More)
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