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Thermal Head

The Thermal Head is a component of a metrological device created to aid in development of new CPUs and chipsets. The first Thermal Head was… Expand
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Related topics

Related topics

3 relations

Broader (1)

Central processing unit
ChipsetSlot 1

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2015
Highly Cited
2015
Treatment of RO brine from CSG produced water by spiral-wound air gap membrane distillation — A pilot study
Abstract Brine management is a major bottleneck for coal seam gas (CSG) production in Australia. This study investigated the… Expand
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Highly Cited
2010
Highly Cited
2010
Reducing Cross-Coupling in a Compliant XY Nanopositioner for Fast and Accurate Raster Scanning
A compliant XY nanopositioner is presented in this brief. The device is designed to have a very low cross-coupling between the X… Expand
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Highly Cited
2007
Highly Cited
2007
Empirical model of the Io plasma torus: Voyager measurements
  • Fr•n B•genM
  • 2007
    • Corpus ID: 109927153
We present • description of pl•sm• conditions in the Io pl•sm• torus, between 5 •nd 10 R•, based on Voyager i observations… Expand
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Highly Cited
2005
Highly Cited
2005
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
Nonuniform thermal profiles on the substrate in high-performance ICs can significantly impact the performance of global on-chip… Expand
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Highly Cited
2004
Highly Cited
2004
Determination of the soot absorption function and thermal accommodation coefficient using low-fluence LII in a laminar coflow ethylene diffusion flame
Effective temperatures of pulsed-laser-heated soot particles were derived from their thermal emission intensities using optical… Expand
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2004
2004
The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints
The electronic industry is making substantial progress toward a full transition to Pb-free soldering in the near future. At… Expand
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Highly Cited
2003
Highly Cited
2003
Application of infrared thermography to the non-destructive testing of concrete and masonry bridges
Abstract Within recent years there has been an increase in the use of NDT methods to detect defects and anomalies in various… Expand
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Highly Cited
2003
Highly Cited
2003
An experimental technique for the measurement of temperature fields for the orthogonal cutting in high speed machining
Cutting temperature and heat generated at the tool-chip interface during high speed machining operations have been recognized as… Expand
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Highly Cited
2002
Highly Cited
2002
Modeling the thermal behavior of a surface-micromachined linear-displacement thermomechanical microactuator
Thermomechanical microactuators possess a number of desirable attributes including ease of fabrication and large force and… Expand
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Highly Cited
2001
Highly Cited
2001
A mechanistic study of oxidation-induced degradation in a plasma-sprayed thermal barrier coating system.: Part II: Life prediction model
A parametric study is conducted to quantify the effects of different microstructural variables and service conditions on the… Expand
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