Slc1a1 protein, rat

Known as: excitatory amino acid carrier 1 protein, rat, Eaac1 protein, rat, Eaat3 protein, rat 
 
National Institutes of Health

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2011
2011
The effect of Ag content on the wetting behavior of Sn-9Zn-xAg on aluminum and copper substrates during soldering, as well as the… (More)
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2010
2010
The microstructures, wettabilities and mechanical properties of Sn–9Zn–xAg (x = 0, 0.1, 0.3, 0.5, 1 wt%) lead-free solders were… (More)
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2009
2009
The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the… (More)
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2009
2009
In order to cut down the cost of Sn-Ag-Cu solder by reducing the content of Ag in the lead-free solder,the soldering wettability… (More)
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2009
2009
The effect of Ag addition in Sn-9Zn solder on its microstructure and wettability was investigated,and interfacial structure of… (More)
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2006
2006
Abstract This study investigates the structural characteristics and tensile properties of the Sn–9Zn– x Ag alloy under an… (More)
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2005
2005
Abstract Solidification behaviors of Sn–9Zn– x Ag lead-free solder alloys, which vary with Ag content, are examined by using… (More)
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2004
2004
The wetting time, wetting force, contact angle and interfacial reaction of Sn-8.55Zn-0A5Al-XAg (mass%) and Sn-9Zn (mass%) lead… (More)
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2003
2003
Abstract The crystal growth, morphology and structure of the intermetallic compounds (IMCs) at the Sn–9Zn– x Ag/Cu interface have… (More)
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2003
2003
The adhesion strength of the Sn-9Zn-xAg/Cu interface was studied. The strength increased from 3.34±0.68 MPa to 7.79±0.57 MPa and… (More)
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