Skip to search form
Skip to main content
Skip to account menu
Semantic Scholar
Semantic Scholar's Logo
Search 218,875,891 papers from all fields of science
Search
Sign In
Create Free Account
Slc1a1 protein, rat
Known as:
excitatory amino acid carrier 1 protein, rat
, Eaac1 protein, rat
, Eaat3 protein, rat
Expand
National Institutes of Health
Create Alert
Alert
Related topics
Related topics
1 relation
Broader (1)
Excitatory Amino Acid Transporter 3
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
Effect of Ag on the Microstructure, Mechanical and Bio-corrosion Properties of Fe–30Mn Alloy
Ruoyu Liu
,
R. He
,
Yanxia Chen
,
Shengfeng Guo
Acta Metallurgica Sinica
2019
Corpus ID: 164337897
In the current work, biodegradable Fe–30Mn–XAg (X = 1, 2, 5, 10 wt%) alloys were prepared by the rapid solidification with copper…
Expand
2009
2009
Investigation on the Wettability and Interfacial Structure of Sn-9Zn-xAg Solders on Cu Substrate
W. Hui
2009
Corpus ID: 138885234
The effect of Ag addition in Sn-9Zn solder on its microstructure and wettability was investigated,and interfacial structure of…
Expand
2009
2009
Wettability test of Sn-0.7Cu-xAg-yBi lead-free solder
W. Guo-qiang
2009
Corpus ID: 138486890
In order to cut down the cost of Sn-Ag-Cu solder by reducing the content of Ag in the lead-free solder,the soldering wettability…
Expand
2004
2004
Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer
Chia-Wei Huang
,
Kwang-Lung Lin
2004
Corpus ID: 85547915
The wetting time, wetting force, contact angle and interfacial reaction of Sn-8.55Zn-0A5Al-XAg (mass%) and Sn-9Zn (mass%) lead…
Expand
2004
2004
Pasty Ranges and Latent Heat Release Modes for Sn-9Zn-xAg Lead-free Solder Alloys
Y. Tsai
,
W. Hwang
2004
Corpus ID: 56403123
The pasty ranges and latent heat release modes of Sn-9Zn-xAg alloys, where x varies between 0.5 and 3.5, are examined in this…
Expand
2004
2004
Effect of thermal cycling on the adhesion strength of Sn-9Zn-xAg-Cu interface
Tao-Chih Chang
,
Min-Hsiung Hon
,
Moo-Chin Wang
,
Dong-Yih Lin
IEEE Transactions on Advanced Packaging
2004
Corpus ID: 8921751
The effect of thermal cycling on the adhesion strength of the Sn-9Zn-xAg-Cu interface has been investigated by using pull-off…
Expand
2003
2003
Microstructures and mechanical properties of Sn – 8 . 55 Zn – 0 . 45 Al – XAg solders
C. Huanga
2003
Corpus ID: 59502637
The microstructure, melting point, and mechanical properties of Sn–8.55Zn–0.45Al– XAg lead-free solders were investigated. The Ag…
Expand
By clicking accept or continuing to use the site, you agree to the terms outlined in our
Privacy Policy
(opens in a new tab)
,
Terms of Service
(opens in a new tab)
, and
Dataset License
(opens in a new tab)
ACCEPT & CONTINUE