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Report Definition Language

Known as: RDL 
Report Definition Language (RDL) is a standard proposed by Microsoft for defining reports. RDL is an XML application primarily used with Microsoft… 
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Related topics

Related topics

4 relations
ActiveReportsMicrosoft SQL ServerSQL Server Reporting ServicesXML

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2016
Highly Cited
2016
InFO (Wafer Level Integrated Fan-Out) Technology
A powerful integrated fan-out (InFO) wafer level system integration (WLSI) technology has been developed to integrate application… 
Highly Cited
2015
Highly Cited
2015
A 10 mW Bluetooth Low-Energy Transceiver With On-Chip Matching
A mass-produced Bluetooth Low-Energy transceiver is presented in classic double frequency VCO architecture fabricated in TSMC 55… 
Highly Cited
2013
Highly Cited
2013
A 90–100-GHz 4 $\times$ 4 SiGe BiCMOS Polarimetric Transmit/Receive Phased Array With Simultaneous Receive-Beams Capabilities
This paper presents a 4 × 4 transmit/receive (T/R) SiGe BiCMOS phased-array chip at 90-100 GHz with vertical and horizontal… 
Highly Cited
2012
Highly Cited
2012
Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
Interconnecting integrated circuits (ICs) and 3-D-ICs to the system board (printed circuit board) are currently achieved using… 
Highly Cited
2011
Highly Cited
2011
Embedded wafer level ball grid array (eWLB) technology for millimeter-wave applications
The embedded wafer level ball grid array (eWLB) is a novel packaging technology that shows excellent performance for millimeter… 
Highly Cited
2010
Highly Cited
2010
3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Interposers for SiP will become more and more important for advanced electronic systems. But through substrate vias are essential… 
Highly Cited
2010
Highly Cited
2010
Next generation eWLB (embedded wafer level BGA) packaging
Demand for wafer level packaging (WLP) is being driven by the need to shrink package size and height, simplify the supply chain… 
2008
2008
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
1998
1998
CCS resource management in networked HPC systems
CCS is a resource management system for parallel high-performance computers. At the user level, CCS provides vendor-independent… 
Highly Cited
1984
Highly Cited
1984
A critique of the SQL database language
The ANS Database Committee (X3H2) is currently at work on a proposed standard relational database language (RDL), and has adopted… 
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