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Report Definition Language
Known as:
RDL
Report Definition Language (RDL) is a standard proposed by Microsoft for defining reports. RDL is an XML application primarily used with Microsoft…
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ActiveReports
Microsoft SQL Server
SQL Server Reporting Services
XML
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2015
Highly Cited
2015
Large area compression molding for Fan-out Panel Level Packing
T. Braun
,
S. Raatz
,
+7 authors
K. Lang
Electronic Components and Technology Conference
2015
Corpus ID: 37420003
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this…
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Highly Cited
2013
Highly Cited
2013
A 90–100-GHz 4 $\times$ 4 SiGe BiCMOS Polarimetric Transmit/Receive Phased Array With Simultaneous Receive-Beams Capabilities
F. Golcuk
,
T. Kanar
,
Gabriel M. Rebeiz
IEEE transactions on microwave theory and…
2013
Corpus ID: 18303061
This paper presents a 4 × 4 transmit/receive (T/R) SiGe BiCMOS phased-array chip at 90-100 GHz with vertical and horizontal…
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2012
2012
Advanced low profile PoP solution with embedded wafer level PoP (eWLB-PoP) technology
S. Yoon
,
Jose Alvin Caparas
,
Yaojian Lin
,
P. Marimuthu
IEEE 62nd Electronic Components and Technology…
2012
Corpus ID: 44746911
Current portable electronic products are driving component packaging towards 3D packaging technologies for integrating multiple…
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2012
2012
Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC
V. Sundaram
,
Q. Chen
,
Y. Suzuki
,
G. Kumar
,
Fuhan Liu
,
R. Tummala
IEEE 62nd Electronic Components and Technology…
2012
Corpus ID: 42919326
This paper presents the design, fabrication and electrical characterization of a low loss and low cost non-traditional silicon…
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Review
2010
Review
2010
Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration
Xuejun Fan
International Conference on Thermal, Mechanial…
2010
Corpus ID: 22395757
In this paper, the state-of-the-art results of research and development in wafer-level packaging (WLP) is reviewed. The paper…
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Highly Cited
2009
Highly Cited
2009
TSV interposer fabrication for 3D IC packaging
V. S. Rao
,
H. Wee
,
+6 authors
P. Damaruganath
Electronic Packaging Technology Conference
2009
Corpus ID: 6749686
In this paper, Through silicon via (TSV) based interposer fabrication processes for 3D stack packaging has been presented. An…
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2008
2008
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
Xiaowu Zhang
,
K. Vaidyanathan
,
T. Chai
,
T. Tan
,
D. Pinjala
Microelectronics and reliability
2008
Corpus ID: 6380779
Highly Cited
2003
Highly Cited
2003
An all-digital PLL for frequency multiplication by 4 to 1022 with seven-cycle lock time
Takamoto Watanabe
,
S. Yamauchi
IEEE J. Solid State Circuits
2003
Corpus ID: 18188306
An all-digital phase-locked loop (PLL) circuit in which resolution in the phase detector and digitally controlled oscillator (DCO…
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1998
1998
CCS resource management in networked HPC systems
A. Keller
,
A. Reinefeld
Heterogeneous Computing Workshop
1998
Corpus ID: 613464
CCS is a resource management system for parallel high-performance computers. At the user level, CCS provides vendor-independent…
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1991
1991
A General Purpose Resource Description Language
B. Bauer
,
F. Ramme
Transputer-Anwender-Treffen
1991
Corpus ID: 40823446
Es wird das Projekt “Zugangssoftware fur ein Umfeld von Parallelrechnern” skizziert. Dieses Projekt behandelt Resourcen…
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