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Report Definition Language
Known as:
RDL
Report Definition Language (RDL) is a standard proposed by Microsoft for defining reports. RDL is an XML application primarily used with Microsoft…
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ActiveReports
Microsoft SQL Server
SQL Server Reporting Services
XML
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2015
Highly Cited
2015
Large area compression molding for Fan-out Panel Level Packing
T. Braun
,
S. Raatz
,
+7 authors
K. Lang
Electronic Components and Technology Conference
2015
Corpus ID: 37420003
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this…
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2012
2012
RDL: A novel approach for passive object localization in WSN based on RSSI
Chen Liu
,
Dingyi Fang
,
+5 authors
Lin X. Cai
IEEE International Conference on Communications…
2012
Corpus ID: 38246757
The Radio Signal Strength Indicator (RSSI)-based localization algorithm is an effective solution for passive object localization…
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2012
2012
Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC
V. Sundaram
,
Q. Chen
,
Y. Suzuki
,
G. Kumar
,
Fuhan Liu
,
R. Tummala
IEEE 62nd Electronic Components and Technology…
2012
Corpus ID: 42919326
This paper presents the design, fabrication and electrical characterization of a low loss and low cost non-traditional silicon…
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2012
2012
Advanced low profile PoP solution with embedded wafer level PoP (eWLB-PoP) technology
S. Yoon
,
Jose Alvin Caparas
,
Yaojian Lin
,
P. Marimuthu
IEEE 62nd Electronic Components and Technology…
2012
Corpus ID: 44746911
Current portable electronic products are driving component packaging towards 3D packaging technologies for integrating multiple…
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2008
2008
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
Xiaowu Zhang
,
K. Vaidyanathan
,
T. Chai
,
T. Tan
,
D. Pinjala
Microelectronics and reliability
2008
Corpus ID: 6380779
2005
2005
Thermomechanical design for reliability of WLPs with compliant interconnects
R. Dudek
,
H. Walter
,
+4 authors
H. Hedler
Electronic Packaging Technology Conference
2005
Corpus ID: 37272133
A wafer level packaging technology ELASTecreg has been developed; which uses a resilient bump contact system. The advantages are…
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Highly Cited
2003
Highly Cited
2003
An all-digital PLL for frequency multiplication by 4 to 1022 with seven-cycle lock time
Takamoto Watanabe
,
S. Yamauchi
IEEE J. Solid State Circuits
2003
Corpus ID: 18188306
An all-digital phase-locked loop (PLL) circuit in which resolution in the phase detector and digitally controlled oscillator (DCO…
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2003
2003
FORGE: a framework for optimization of distributed embedded systems software
R. Cornea
,
N. Dutt
,
+4 authors
S. Shukla
Proceedings International Parallel and…
2003
Corpus ID: 2091108
FORGE brings together a number of advances in architectural modeling, software architecture and distributed/real-time systems to…
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1998
1998
CCS resource management in networked HPC systems
A. Keller
,
A. Reinefeld
Heterogeneous Computing Workshop
1998
Corpus ID: 613464
CCS is a resource management system for parallel high-performance computers. At the user level, CCS provides vendor-independent…
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1991
1991
A General Purpose Resource Description Language
B. Bauer
,
F. Ramme
Transputer-Anwender-Treffen
1991
Corpus ID: 40823446
Es wird das Projekt “Zugangssoftware fur ein Umfeld von Parallelrechnern” skizziert. Dieses Projekt behandelt Resourcen…
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