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Report Definition Language

Known as: RDL 
Report Definition Language (RDL) is a standard proposed by Microsoft for defining reports. RDL is an XML application primarily used with Microsoft… Expand
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2016
Highly Cited
2016
A powerful integrated fan-out (InFO) wafer level system integration (WLSI) technology has been developed to integrate application… Expand
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Highly Cited
2015
Highly Cited
2015
A mass-produced Bluetooth Low-Energy transceiver is presented in classic double frequency VCO architecture fabricated in TSMC 55… Expand
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Highly Cited
2012
Highly Cited
2012
Interconnecting integrated circuits (ICs) and 3-D-ICs to the system board (printed circuit board) are currently achieved using… Expand
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Highly Cited
2011
Highly Cited
2011
We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the… Expand
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Highly Cited
2011
Highly Cited
2011
In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design… Expand
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Highly Cited
2011
Highly Cited
2011
The embedded wafer level ball grid array (eWLB) is a novel packaging technology that shows excellent performance for millimeter… Expand
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Highly Cited
2010
Highly Cited
2010
Demand for wafer level packaging (WLP) is being driven by the need to shrink package size and height, simplify the supply chain… Expand
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Highly Cited
2010
Highly Cited
2010
Interposers for SiP will become more and more important for advanced electronic systems. But through substrate vias are essential… Expand
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2008
2008
Abstract Wafer level packaging (WLP) has many advantages, such as ease of fabrication and reduced fabrication cost. However… Expand
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Highly Cited
2007
Highly Cited
2007
In this paper, we discuss the limitations of the current syntactic composition mechanisms in aspect-oriented requirements… Expand
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