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Plating
Known as:
Electroless Plating
, Metal plating
, Silver plating
Â
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Plating is a surface covering in which a metal is deposited on a conductive surface. Plating has been done for hundreds of years; it is also critical…Â
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Wikipedia
Topic mentions per year
Topic mentions per year
1967-2018
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1967
2018
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Related mentions per year
Related mentions per year
1937-2018
1940
1960
1980
2000
2020
Plating
Semiconductor device fabrication
Printed circuit board
Electrical connector
Sputter deposition
Integrated circuit packaging
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Influence of Buffer Carbon Doping on Pulse and AC Behavior of Insulated-Gate Field-Plated Power AlGaN/GaN HEMTs
Giovanni Verzellesi
,
L. G. Morassi
,
+7 authors
Gilberto Curatola
IEEE Electron Device Letters
2014
Pulse behavior of insulated-gate double-field-plate power AlGaN/GaN HEMTs with C-doped buffers showing small current-collapse…Â
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2007
2007
Copper Via Plating in Three Dimensional Interconnects
W. Worwag
,
Thibault Dory
2007 Proceedings 57th Electronic Components and…
2007
This paper describes the development of deep via plating in silicon substrates. Straight walled and tapered vias were plated…Â
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2006
2006
Peel and Shear Fracture Characterization of Debonding in FRP Plated Concrete Affected by Moisture
Ching Au
2006
The objective of this paper is to develop a new mechanistic understanding of moisture affected debonding failures in carbon fiber…Â
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Highly Cited
2005
Highly Cited
2005
A pentatricopeptide repeat protein is essential for RNA editing in chloroplasts.
Emi Kotera
,
Masao Tasaka
,
Toshiharu Shikanai
Nature
2005
RNA editing is a process of RNA maturation involved in the insertion, deletion or modification of nucleotides. In organellar…Â
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2005
2005
Electroless Nickel Plating: Bath Control
Robert Tenno
,
Kaisa Kantola
,
H. N. Koivo
2005
In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of…Â
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Highly Cited
2004
Highly Cited
2004
The role of barren stalk1 in the architecture of maize.
Andrea Gallavotti
,
Qiong Zhao
,
+5 authors
Robert J. Schmidt
Nature
2004
The architecture of higher plants is established through the activity of lateral meristems--small groups of stem cells formed…Â
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2003
2003
Electroless Nickel Plating on Magnesium Alloy
M. R. Suresh
,
H. Bhojraj
,
Harsha Narayanamurthy
,
Ranabir Sahu
2003
he inherent lightness and good strength-to-weight ratio of T magnesium has focused attention on increasing applications in…Â
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2003
2003
High Performance Gold Plating for Microdevices
A. Gemmler
,
H. Richter
2003
Tremendous improvements in the performance of microelectronic devices have been creating increased demands on fabrication…Â
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1997
1997
Electroless Gold Plating For Semiconductor Package Substrate
K. Hasegawa
,
A. Takahashi
,
A. Nakaso
IEMT/IMC Symposium, 1st [Joint International…
1997
The density of circuits on substrate mounted semiconductor devices has been rapidly increasing. To meet this growing need…Â
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Review
1992
Review
1992
Barrel Chromium Plating from a Trivalent
CHROMIUM ELECTROLYTE
,
T Harshaw
,
Subramaniam N
1992
Decorative chromium plating from trivalent chromium solutions is gaining commercial acceptance. The advantages of plating…Â
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