Nanium
National Institutes of Health
Papers overview
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Due to its versatility for high density, heterogeneous integration, Wafer Level Fan Out (WLFO) packaging has recently seen a…
Expanding FOWLP (Fan-Out Wafer-Level Packaging) from mainly 2D single or multi die solutions to 3D stacked multi-die solutions…
Wafer-Level Packaging (WLP) technology is quickly expanding to face the challenges of the next big wave of Internet of Things…
The Internet of Things/ Everything (IoT/E) will require billions of single or multiple MEMS/ Sensors integrated in modules…
There is no doubt that component embedding technology becomes more visible in handheld applications like smart phones and…
NANIUM's Fan-Out Wafer-Level Packaging technology WLFO (Wafer-Level Fan-Out) is based on embedded Wafer Level Ball Grid Array…
WLP has been a gradually adopted by the industry during the last years due to its unique characteristics regarding package size…
Embedded Wafer Level Ball Grid Array (eWLB) [1] since it's invention has been the leading technology for Fan-Out Wafer-Level…
Market is requesting more and more IC packages capable to cope with more demanding reliability requirements, in order to meet…
With increasing focus on system approaches, also advanced semiconductor packaging becomes more diversified and fairly more…