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Memory controller
Known as:
Memory scrambling
, MCU
, Memory controller unit
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The memory controller is a digital circuit that manages the flow of data going to and from the computer's main memory. A memory controller can be a…
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Related topics
Related topics
50 relations
8-bit
Adreno
Apollo VP3
Apple A6X
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Broader (1)
Computer memory
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2015
Highly Cited
2015
Corrigendum #2 to “On Synergistic Integration of Adaptive Dithering Based Internal Model Control for Hysteresis Compensation in Piezoactuated Nanopositioner”
S. K. Shome
,
M. Prakash
,
S. Pradhan
,
A. Mukherjee
Mathematical Problems in Engineering
2015
Corpus ID: 54992526
Piezoelectric-stack actuated platforms are very popular in the parlance of nanopositioning with myriad applications like micro…
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Highly Cited
2011
Highly Cited
2011
Robust guaranteed cost control of discrete‐time networked control systems
Ligang Wu
,
J. Lam
,
Xiu-ming Yao
,
J. Xiong
2011
Corpus ID: 49583618
This paper is concerned with the robust guaranteed cost control problem for networked control systems (NCSs). The plant…
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2006
2006
A comparative study of fuzzy logic controllers for autonomous robots.
S. Coupland
,
M. Gongora
,
R. John
,
K. Wills
2006
Corpus ID: 51682785
This paper presents the results from an experimental comparison of a number of fuzzy logic controllers performing mobile robot…
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Highly Cited
2006
Highly Cited
2006
Damping Controller Design for Power System Oscillations
R. Sadikovic
,
G. Andersson
,
P. Korba
Intelligent Automation and Soft Computing
2006
Corpus ID: 17129285
Abstract This paper describes a design of power oscillation damping (POD) as an add-on feature for power flow control. The…
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Highly Cited
2006
Highly Cited
2006
Evaluation of board-level reliability of electronic packages under consecutive drops
Chang-Lin Yeh
,
Y. Lai
,
C. Kao
Microelectronics and reliability
2006
Corpus ID: 206943669
2006
2006
Drop impact analysis of Sn-Ag-Cu solder joints using dynamic high-strain rate plastic strain as the impact damage driving force
J. Pang
,
F. Che
Electronic Components and Technology Conference
2006
Corpus ID: 20431284
Board-level drop reliability test and analysis requires dynamic characterization of high strain-rate properties of bulk solder…
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Highly Cited
2005
Highly Cited
2005
Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad
Shengquan E. Ou
,
Yuhuan Xu
,
K. Tu
,
M. O. Alam
,
Y. Chan
Proceedings Electronic Components and Technology…
2005
Corpus ID: 37215567
The most frequent failure of wireless, handheld, and movable consumer electronic products is an accidental drop to the ground…
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Highly Cited
2003
Highly Cited
2003
A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy
Young-Doo Jeon
,
S. Nieland
,
A. Ostmann
,
H. Reichl
,
K. Paik
2003
Corpus ID: 95793539
Even though electroless Ni-P and Sn-Ag-Cu solders are widely used materials in flip-chip bumping technologies, interfacial…
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Highly Cited
2000
Highly Cited
2000
A programmable MAC framework for utility-based adaptive quality of service support
G. Bianchi
,
A. Campbell
IEEE Journal on Selected Areas in Communications
2000
Corpus ID: 3527382
We describe the design and evaluation of a programmable medium access control framework which is based on a hybrid centralized…
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1996
1996
DSP-based robust control of an AC induction servo drive for motion control
Y. Tzou
IEEE Transactions on Control Systems Technology
1996
Corpus ID: 16248431
A design method based on the internal model control (IMC) theory has been developed for the robust control of a low-power AC…
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