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List of free and open-source software packages

Known as: Free Packages, List of free and open source software packages, List of open source educational software packages 
This is a list of free and open-source software packages, computer software licensed under free software licenses and open-source licenses. Software… 
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Papers overview

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2018
2018
Personalized Hotel Recommendation based on Social Networks
Recommender systems have become an important tool for users to identify interesting items as well as for businesses to promote… 
2016
2016
Open source structure-from-motion for aerial video
Structure-from-motion (SfM) is a well-studied problem in the computer vision field and is of particular interest for aerial… 
Review
2012
Review
2012
Reliability of large die ultra low-k lead-free flip chip packages
  • L. Yip
  • IEEE 62nd Electronic Components and Technology…
  • 2012
  • Corpus ID: 36436064
With the industry movement towards lead-free solders and advanced silicon process nodes with ultra low-k dielectrics, flip chip… 
2011
2011
Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions
In this paper, we report a comprehensive set of accelerated thermal cycling (ATC) tests that were performed on test vehicles with… 
2009
2009
Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests
Lead-free solder interconnection reliability of thin fine-pitch ball grid array (BGA) lead-free packages has been studied… 
2008
2008
Flip-Chip Packaging Technology for Enabling 45 nm Products
Intel’s packaging team has been working on developing completely Pb-free packages that can be utilized in a variety of products… 
2007
2007
Joint interval reliability for Markov systems with an application in transmission line reliability
  • A. Csenki
  • Reliab. Eng. Syst. Saf.
  • 2007
  • Corpus ID: 19063050
Highly Cited
2006
Highly Cited
2006
McRT-Malloc: a scalable transactional memory allocator
Emerging multi-core processors promise to provide an exponentially increasing number of hardware threads with every generation… 
2005
2005
Drop impact life prediction model for lead-free BGA packages and modules
System-in-package (SiP) such as multi-chip or stacked die BGA modules with wirebond, flip-chip or hybrid interconnect are getting… 
Review
1995
Review
1995
A Review of the Generic Computer Programs ALEX, RAMAS/space and VORTEX for Modelling the Viability of Wildlife Metapopulations
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