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List of free and open-source software packages
Known as:
Free Packages
, List of free and open source software packages
, List of open source educational software packages
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This is a list of free and open-source software packages, computer software licensed under free software licenses and open-source licenses. Software…
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2016
2016
C-language package for standalone embedded atom method molecular dynamics simulations of fcc structures
R. Ocaya
,
J. J. Terblans
SoftwareX
2016
Corpus ID: 62911446
Review
2012
Review
2012
Reliability of large die ultra low-k lead-free flip chip packages
L. Yip
IEEE 62nd Electronic Components and Technology…
2012
Corpus ID: 36436064
With the industry movement towards lead-free solders and advanced silicon process nodes with ultra low-k dielectrics, flip chip…
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2011
2011
Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions
Hongtao Ma
,
M. Ahmad
,
K. Liu
IEEE Transactions on Components, Packaging, and…
2011
Corpus ID: 7998253
In this paper, we report a comprehensive set of accelerated thermal cycling (ATC) tests that were performed on test vehicles with…
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2011
2011
Open source data mining tools for audit purposes
Nádia Valls de Almeida
,
I. Pedrosa
OSDOC '11
2011
Corpus ID: 45666864
In a fast-growing market as software development, open source applications are an increase tendency by granting choice and…
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2011
2011
VICKY: A COMPUTER CODE FOR USE IN THE DESIGN AND SIMULATION OF PARTICLE ACCELERATORS
F. Iazzourene
,
S. Trieste
2011
Corpus ID: 41287635
Vicky is a computer code under development for designing and simulating particle accelerators. Like other existing codes, the…
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2010
2010
Solder joint encapsulation and reliability using dippable underfill
Y. Yeo
,
Mark Huang
,
+5 authors
Shan Gao
Electronic Packaging Technology Conference
2010
Corpus ID: 11450720
The demand for flip chip devices is rising to meet increasingly strict requirements for smaller package size, multiple-die…
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2009
2009
Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests
Jue Li
,
J. Karppinen
,
Tomi Laurila
,
J. Kivilahti
IEEE transactions on components and packaging…
2009
Corpus ID: 45698423
Lead-free solder interconnection reliability of thin fine-pitch ball grid array (BGA) lead-free packages has been studied…
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2008
2008
Flip-Chip Packaging Technology for Enabling 45 nm Products
N. Patel
2008
Corpus ID: 15702546
Intel’s packaging team has been working on developing completely Pb-free packages that can be utilized in a variety of products…
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2007
2007
Joint interval reliability for Markov systems with an application in transmission line reliability
A. Csenki
Reliability Engineering & System Safety
2007
Corpus ID: 19063050
2005
2005
Drop impact life prediction model for lead-free BGA packages and modules
J. Luan
,
T. Y. Tee
,
+7 authors
A. Kujala
EuroSimE . Proceedings of the 6th International…
2005
Corpus ID: 17136611
System-in-package (SiP) such as multi-chip or stacked die BGA modules with wirebond, flip-chip or hybrid interconnect are getting…
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