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List of free and open-source software packages

Known as: Free Packages, List of free and open source software packages, List of open source educational software packages 
This is a list of free and open-source software packages, computer software licensed under free software licenses and open-source licenses. Software… 
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Papers overview

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2016
2016
C-language package for standalone embedded atom method molecular dynamics simulations of fcc structures
Review
2012
Review
2012
Reliability of large die ultra low-k lead-free flip chip packages
  • L. Yip
  • IEEE 62nd Electronic Components and Technology…
  • 2012
  • Corpus ID: 36436064
With the industry movement towards lead-free solders and advanced silicon process nodes with ultra low-k dielectrics, flip chip… 
2011
2011
Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions
In this paper, we report a comprehensive set of accelerated thermal cycling (ATC) tests that were performed on test vehicles with… 
2011
2011
Open source data mining tools for audit purposes
In a fast-growing market as software development, open source applications are an increase tendency by granting choice and… 
2009
2009
Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests
Lead-free solder interconnection reliability of thin fine-pitch ball grid array (BGA) lead-free packages has been studied… 
2008
2008
Flip-Chip Packaging Technology for Enabling 45 nm Products
Intel’s packaging team has been working on developing completely Pb-free packages that can be utilized in a variety of products… 
2007
2007
Joint interval reliability for Markov systems with an application in transmission line reliability
Highly Cited
2006
Highly Cited
2006
McRT-Malloc: a scalable transactional memory allocator
Emerging multi-core processors promise to provide an exponentially increasing number of hardware threads with every generation… 
2005
2005
Drop impact life prediction model for lead-free BGA packages and modules
System-in-package (SiP) such as multi-chip or stacked die BGA modules with wirebond, flip-chip or hybrid interconnect are getting… 
Review
1995
Review
1995
A Review of the Generic Computer Programs ALEX, RAMAS/space and VORTEX for Modelling the Viability of Wildlife Metapopulations
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