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List of free and open-source software packages
Known as:
Free Packages
, List of free and open source software packages
, List of open source educational software packages
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This is a list of free and open-source software packages, computer software licensed under free software licenses and open-source licenses. Software…
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2016
2016
C-language package for standalone embedded atom method molecular dynamics simulations of fcc structures
R. Ocaya
,
J. J. Terblans
SoftwareX
2016
Corpus ID: 62911446
2014
2014
Vicky: Computer Code Update
Fatma Iazzourene
2014
Corpus ID: 110901252
Vicky is a computer code for designing and simulating charged particle accelerators[1]. We recall mainly that Vicky is a very…
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2011
2011
Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions
Hongtao Ma
,
M. Ahmad
,
K. Liu
IEEE Transactions on Components, Packaging, and…
2011
Corpus ID: 7998253
In this paper, we report a comprehensive set of accelerated thermal cycling (ATC) tests that were performed on test vehicles with…
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2008
2008
Flip-Chip Packaging Technology for Enabling 45 nm Products
N. Patel
2008
Corpus ID: 15702546
Intel’s packaging team has been working on developing completely Pb-free packages that can be utilized in a variety of products…
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2007
2007
AN EPIDEMIOLOGIC CALCULATOR SUPPORTING SPANISH SPEAKING VETERINARIANS IN A RESOURCE-LIMITED COMPUTING ENVIRONMENT
K. Suzuki
,
M. Risso
,
+4 authors
E. Pons
2007
Corpus ID: 82920937
ABSTRACT: Statistical analysis is fundamental to the field of epidemiologic research. How - ever, commercial statistical software…
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2006
2006
CHANGES IN THE PETROGRAPHIC COMPOSITION OF COAL DURING COAL PROCESSING
K. Probierz
,
M. Marcisz
2006
Corpus ID: 56016896
The changes in petrographic composition and in some technological properties of coal have been investigated in the deposit, as…
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2006
2006
Non-Empirical Modeling of Fatigue in Lead-Free Solder Joints: Fatigue Failure Analysis and Estimation of Fracture Parameters
D. Bhate
,
D. Chan
,
G. Subbarayan
International Conference on Thermal, Mechanial…
2006
Corpus ID: 359656
Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and…
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Review
2006
Review
2006
Qualification of low-k 90nm technology dies with Pb-free bumps on a build-up laminate package (PBGA) with Pb-free assembly processes
S. Ray
,
S. Kiyono
,
K. Waite
,
L. Nicholls
Electronic Components and Technology Conference
2006
Corpus ID: 5182057
Flip-chip packages have become the preferred solution for high-performance ASIC and microprocessor devices. Typically these are…
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2000
2000
Simulations and the Need for Free Software
A. Cechin
,
M. Barcellos
,
Ernesto Lindstaedt
2000
Corpus ID: 16072524
Simulation is the process of designing a model of a real system and conducting experiments with this model for the purpose either…
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1992
1992
Measurements of relative permeability, absolute permeability and fracture geometry in coal
L. Patersool
,
M. Smyth
1992
Corpus ID: 56189966
Adequate permeability is vital to the coalbed methane industry. We report here on tfuee issues of importqnce to the subject of…
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