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Internet Listing Display

Known as: ILD 
Internet Listing Display (ILD) was a set of rules put forth by the National Association of Realtors in 2005 to regulate how homes and properties can… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Review
2013
Review
2013
DISCOVERY OF A DYNAMICAL COLD POINT IN THE HEART OF THE SAGITTARIUS dSph GALAXY WITH OBSERVATIONS FROM THE APOGEE PROJECT
The dynamics of the core of the Sagittarius (Sgr) dwarf spheroidal (dSph) galaxy are explored using high-resolution (R ∼ 22, 500… 
2012
2012
The CLIC ILD CDR Geometry for the CDR Monte Carlo Mass Production
The CLIC ILD CDR detector for the Monte Carlo event simulation is described in a GEANT4 application, with some parameters… 
2010
2010
Challenges of Cu wire bonding on low-k/Cu wafers with BOA structures
This study describes the development of a Cu wire bond assembly solution for ICs using low dielectric constant (low K… 
Highly Cited
2009
Highly Cited
2009
Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs
Through-Silicon Via (TSV) is a critical interconnect element in 3D integration technology. TSVs introduce many new design… 
2008
2008
Preparation, microstructure, and property characterizations of fluorinated polyimide-organosilicate hybrids
2006
2006
Sea-of-leads MEMS I/O interconnects for low-k IC packaging
Technology feasibility of MEMS-type chip I/O interconnects (namely Sea-of-Leads or SoL) is demonstrated. Acting like a spring, a… 
Highly Cited
2003
Highly Cited
2003
Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical Planarization
In this work, real-time coefficient of friction (COF) analysis, in conjunction with a new method for approximating the Sommerfeld… 
2003
2003
Process roadmap and challenges for metal barriers [copper interconnects]
Copper interconnects require two types of barrier layers: a liner on the sides and bottoms of the damascene features and a cap on… 
1997
1997
An improved NbN integrated circuit process featuring thick NbN ground plane and lower parasitic circuit inductances
We report on the development of a 10 K, NbN superconductive integrated circuit (IC) technology that utilizes an improved SiO/sub… 
1996
1996
The MOS inversion layer as a minority carrier injector
In this paper we report the first experimental demonstration of the concept of MOS inversion layer injection (ILI). The new… 
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