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Intel QuickPath Interconnect
Known as:
Intel QPI
, Common Serial Interconnection
, QPI interface
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The Intel QuickPath Interconnect (QPI) is a point-to-point processor interconnect developed by Intel which replaced the front-side bus (FSB) in Xeon…
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Related topics
Related topics
37 relations
Arrandale
Broadwell (microarchitecture)
Chipset
DEC Alpha
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Optics vs. copper — From the perspective of Thunderbolt 3 interconnect technology
Hengju Cheng
,
Jerry Gao
,
+4 authors
C. Krause
China Semiconductor Technology International…
2016
Corpus ID: 37869630
"Thunderbolt 3" has adopt both copper and optical interconnect technologies, depends on the cable length used. Single cable can…
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2014
2014
Analysis of RLC interconnect delay model using second order approximation
Muhammad Sanaullah
,
M. Chowdhury
International Symposium on Circuits and Systems
2014
Corpus ID: 29210996
Continuous scaling of CMOS technology leads to extremely fast device. However, the resulting interconnect structures impose so…
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2009
2009
Monolithic graphene nanoribbon electronics for interconnect performance improvement
Sansiri Tanachutiwat
,
Shuhong Liu
,
R. Geer
,
Wei Wang
IEEE International Symposium on Circuits and…
2009
Corpus ID: 38564861
In this paper, multi-layer graphene nanoribbon (GNR) is proposed as an emerging interconnect solution, which can be integrated…
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2007
2007
On Channel State Inference and Prediction Using Observable Variables in 802.11b Network
Shirish S. Karande
,
S. A. Khayam
,
+4 authors
Jinwoo Hong
IEEE International Conference on Communications
2007
Corpus ID: 17225391
Performance of cross-layer protocols that recommend the relay of corrupted packets to higher layers can be improved significantly…
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2005
2005
SR ARQ for adaptive modulation systems combined with selection transmit diversity
G. Femenias
IEEE Transactions on Communications
2005
Corpus ID: 1343049
Adaptive automatic repeat request (ARQ) schemes are quite effective for throughput enhancement in time-varying mobile channel…
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Review
2002
Review
2002
On-chip inductance cons and pros
Y. Ismail
IEEE Transactions on Very Large Scale Integration…
2002
Corpus ID: 6560683
Provides a high level survey of the increasing effects of on-chip inductance. These effects are classified into desirable and…
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2000
2000
Power chip interconnection : From wire bonding to area bonding
Xingsheng Liu
,
G. Lu
2000
Corpus ID: 51823724
Inside the state-of-the-art power devices and power modules, interconnection of power devices is accomplished with wirebonds…
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Highly Cited
1996
Highly Cited
1996
High-speed clock network sizing optimization based on distributed RC and lossy RLC interconnect models
Qing K. Zhu
,
W. Dai
IEEE Trans. Comput. Aided Des. Integr. Circuits…
1996
Corpus ID: 37566492
To achieve path delay balance, instead of making faster paths slower by elongating wires used in most zero skew clock routing…
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1994
1994
Dielectric materials for advanced VLSI and ULSI technologies
Y. Obeng
,
K. Steiner
,
A. Velaga
,
Chien-Shing Pal
AT&T Technical Journal
1994
Corpus ID: 33393583
Advancements in very-large-scale integration (VISI) and ultra-large-scale integration (ULSI) of semiconductor devices result in…
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1992
1992
Multiprotocol Interconnect on X.25 and ISDN in the Packet Mode
A. Malis
,
David Robinson
,
R. Ullmann
Request for Comments
1992
Corpus ID: 881557
This document specifies the encapsulation of IP and other network layer protocols over X.25 networks, in accordance and alignment…
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