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Fill device

Known as: DS-102, Fill, DS-101 
A fill device or key loader is a module used to load cryptographic keys into electronic encryption machines. Fill devices are usually hand held and… 
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Related topics

Related topics

17 relations
AN/CYZ-10EncryptionFASCINATORFialka

Broader (1)

Key management

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
H-1B visas by the numbers [Resources_at Work]
The H-1B visa program is designed to allow foreign professionals to work in the United States for up to six years. The program's… 
2017
2017
Selling Hope and College: Merit, Markets, and Recruitment in an Unranked School
Excerpt] It has long been assumed that college admission should be a simple matter of sorting students according to merit, with… 
2014
2014
The Assessment of the Collapse Potential of Fills during Inundation using Plate Load Tests
Fill materials which have been inadequately compacted or placed excessively dry usually undergo a reduction in volume when their… 
2014
2014
Response of Circular Footing by Varying theVertical Spacing of Reinforcement Resting onStructural Fill
Non availability of suitable construction site due to rapid growth of population requires use of low laying areas. Low laying… 
2013
2013
Importance of Measuring Supply Chain Management Performance
A supply chain is a system of facilities that procure raw materials, transform them into intermediate goods and then final… 
2012
2012
O potencial cariostático de quatro diferentes tipos de selantes em dentes bovinos: estudo ex vivo
Objective: The aim of this research was to evaluated the cariostatic effect of four different types of sealants. Material and… 
2012
2012
A Mathematical Treatment of the Fluorescence Capillary-Fill Device
A mathematical model in the form of two coupled diffusion equations is provided for a competitive chemical reaction between an… 
2011
2011
STABILISATION OF MARGINAL SOIL USING TYRE CHIPS WITHOUT AND WITH CEMENT MODIFICATION
In view of the scarcity for suitable granular soils at several work sites, the use of marginal soils is being studied by various… 
2009
2009
QC-Fill: An X-Fill method for quick-and-cool scan test
In this paper, we present an X-Fill (QC-Fill) method for not only slashing the test time but also reducing the test power… 
Review
2007
Review
2007
C4NP Technology for Lead Free Solder Bumping
C4NP is a novel solder bumping technology developed by IBM that addresses the limitations of existing bumping technologies by… 
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