FAQ

FR-4

Known as: ERBGF, Epoxy resin bonded glass fabric, Fr4 
FR-4 (or FR4) is a grade designation assigned to glass-reinforced epoxy laminate sheets, tubes, rods and printed circuit boards (PCB). FR-4 is a… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

1988-2017
05010019882017

Related topics

Related topics

15 relations
AlSiCCapacitive sensingFR-2Flexible circuit
(More)

Related mentions per year

Related mentions per year

1948-2018
19401960198020002020
FR-4
Relay
Transformer
Microstrip
Printed circuit board
Signal integrity

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
Grid Assembly-Free 60-GHz Antenna Module Embedded in FR-4 Transceiver Carrier Board
A novel antenna module solution which dramatically alleviates cost and fabrication related limitations of traditional 60-GHz… (More)
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2012
2012
Millimeter-wave coplanar interconnects and radiators on FR-4 laminates
This paper demonstrates coplanar waveguide (CPW) interconnects and radiators for antenna-in-package (AiP) solutions at millimeter… (More)
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2010
2010
Reliability of ACF Interconnections on FR-4 Substrates
The use of anisotropic conductive adhesives (ACA) in flip chip interconnection technology has become very popular because of… (More)
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2008
2008
FR-4 Embedded Wideband Micro-Balun with Coupled LC Resonators
In this paper, a compact wideband balun has been newly designed and fabricated by using magnetically coupled LC resonators. The… (More)
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2007
2007
Viscoelastic Effect of FR-4 Material on Packaging Stress Development
  • Y. K. Kim
  • IEEE Transactions on Advanced Packaging
  • 2007
In the microelectronics device, FR-4 material is one of the key component materials in the packaging structure. The structure of… (More)
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2007
2007
Design and Use of FR-4 CBCPW Lines In Test Fixtures for SMD Components
High frequency/speed designs still predominantly use microstrip lines on relatively cheap FR-4 substrates, despite their… (More)
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2006
2006
Novel optoelectronic LSI packaging suitable for standard FR-4 printed wiring board with bandwidth capability of over 1 Tbps
A novel optoelectronic LSI package using a post-reflow optical-interface stacking technique (POST), which enables high speed… (More)
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Highly Cited
2001
Highly Cited
2001
Wideband frequency-domain characterization of FR-4 and time-domain causality
FR-4 is one of the most widely used dielectric substrates in the fabrication of printed circuits for fast digital devices. This… (More)
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2001
2001
Flip Chip Joining on FR-4 Substrate Using ACFs
Anisotropic conductive adhesive films (ACF) were used to attach daisy-chained test chips on FR4 substrates. The feasibility of… (More)
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Highly Cited
2001
Highly Cited
2001
An Adaptive PAM-4 5-Gb/s Backplane Transceiver in 0.25- m CMOS
This paper describes a backplane transceiver, which uses pulse amplitude modulated four-level (PAM-4) signaling and continuously… (More)
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