FR-4

Known as: ERBGF, Epoxy resin bonded glass fabric, Fr4 
FR-4 (or FR4) is a grade designation assigned to glass-reinforced epoxy laminate sheets, tubes, rods and printed circuit boards (PCB). FR-4 is a… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

1988-2017
05010019882017

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2013
2013
A novel antenna module solution which dramatically alleviates cost and fabrication related limitations of traditional 60-GHz… (More)
  • figure 1
  • figure 3
  • figure 2
  • figure 4
  • figure 5
Is this relevant?
2012
2012
This paper demonstrates coplanar waveguide (CPW) interconnects and radiators for antenna-in-package (AiP) solutions at millimeter… (More)
  • figure 1
  • table I
  • figure 3
  • figure 2
  • figure 4
Is this relevant?
2010
2010
The use of anisotropic conductive adhesives (ACA) in flip chip interconnection technology has become very popular because of… (More)
  • table I
  • figure 2
  • figure 1
  • table II
  • table III
Is this relevant?
2008
2008
In this paper, a compact wideband balun has been newly designed and fabricated by using magnetically coupled LC resonators. The… (More)
  • figure 1
  • figure 2
  • figure 4
  • figure 3
  • figure 5
Is this relevant?
2007
2007
  • Y. K. Kim
  • IEEE Transactions on Advanced Packaging
  • 2007
In the microelectronics device, FR-4 material is one of the key component materials in the packaging structure. The structure of… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2007
2007
High frequency/speed designs still predominantly use microstrip lines on relatively cheap FR-4 substrates, despite their… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
2006
2006
A novel optoelectronic LSI package using a post-reflow optical-interface stacking technique (POST), which enables high speed… (More)
  • figure 3
  • table 1
  • table 2
Is this relevant?
Highly Cited
2001
Highly Cited
2001
FR-4 is one of the most widely used dielectric substrates in the fabrication of printed circuits for fast digital devices. This… (More)
Is this relevant?
2001
2001
Anisotropic conductive adhesive films (ACF) were used to attach daisy-chained test chips on FR4 substrates. The feasibility of… (More)
  • table 1
  • table 2
  • figure 2
  • figure 3
  • figure 1
Is this relevant?
Highly Cited
2001
Highly Cited
2001
This paper describes a backplane transceiver, which uses pulse amplitude modulated four-level (PAM-4) signaling and continuously… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?