Skip to search form
Skip to main content
Skip to account menu
Semantic Scholar
Semantic Scholar's Logo
Search 222,828,448 papers from all fields of science
Search
Sign In
Create Free Account
DIMES
Known as:
Dime
DIMES was a subproject of the EVERGROW Integrated Project in the EU Information Society Technologies, Future and Emerging Technologies programme. It…
Expand
Wikipedia
(opens in a new tab)
Create Alert
Alert
Related topics
Related topics
3 relations
Internet
List of distributed computing projects
Network mapping
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Three engineered allogeneic porcine iPSs scaffolds after myocardial infarction in swine
C. Gálvez-Montón
,
C. Soler-Botija
,
+10 authors
A. Bayés‐Genís
2016
Corpus ID: 86505211
INTRODUCTION: Engineered constructs using induced pluripotent stem (iPS) cells to regenerate a myocardial scar may become true…
Expand
2015
2015
Stable estimation of horizontal velocity for planetary lander with motion constraints
Wei Shao
,
Shulin Sui
,
Lin Meng
,
Ya-zhou Yue
IEEE/CAA Journal of Automatica Sinica
2015
Corpus ID: 37570892
The planetary lander usually selects image feature points and tracks them from frame to frame in order to determine its own…
Expand
2014
2014
High aspect ratio lithography for litho-defined wire bonding
Zahra Kolahdouz Esfahani
,
H. V. van Zeijl
,
G. Zhang
Electronic Components and Technology Conference
2014
Corpus ID: 24277443
To overcome some challenges and reliability issues of wire bonding, a study of a new interconnect technique is done. High aspect…
Expand
2008
2008
An Assessment of µ-Czochralski, Single-Grain Silicon Thin-Film Transistor Technology for Large-Area, Sensor and 3-D Electronic Integration
N. Saputra
,
M. Danesh
,
+4 authors
S. Inoue
IEEE Journal of Solid-State Circuits
2008
Corpus ID: 15046764
Single-grain (SG) thin-film transistors (TFTs) fabricated inside location-controlled silicon grains using the mu-Czochralski…
Expand
2007
2007
Local Sealing of High Aspect Ratio Vias for Single Step Bottom-up Copper Electroplating of Through Wafer Interconnects
M. Saadaoui
,
W. Wien
,
H. Zeijl
,
H. Schellevis
,
M. Laros
,
P. Sarro
Italian National Conference on Sensors
2007
Corpus ID: 35167243
This paper presents a novel technology for copper electroplating in high aspect ratio silicon vias. The described approach is…
Expand
2007
2007
A Low-Loss Compact Linear Varactor Based Phase-Shifter
J. Qureshi
,
S. Kim
,
+6 authors
L. D. de Vreede
IEEE Radio Frequency Integrated Circuits (RFIC…
2007
Corpus ID: 2458000
Design trade-offs are presented for varactor-based variable phase-shifters in terms of size, tuning range, bandwidth/phase…
Expand
2005
2005
Intersection characteristics of end-to-end Internet paths and trees
Sevcan Bilir
,
Kamil Saraç
,
Turgay Korkmaz
IEEE International Conference on Network…
2005
Corpus ID: 1505042
This paper focuses on understanding the scale and the distribution of "state overhead'' (briefly load) that is incurred on the…
Expand
2005
2005
Low-distortion, low-loss varactor-based adaptive matching networks, implemented in a silicon-on-glass technology
K. Buisman
,
L. D. de Vreede
,
+5 authors
L. Nanver
IEEE Radio Frequency integrated Circuits (RFIC…
2005
Corpus ID: 12272721
A low-loss, low-distortion continuously tunable matching network, is demonstrated at 2 GHz in a silicon-on-glass varactor IC…
Expand
2004
2004
Integrated Coulter counter based on 2-dimensional liquid aperture control
J. H. Nieuwenhuisa
,
F. Kohlb
,
J. Bastemeijerc
,
P. M. Sarrod
,
M. J. Vellekoopa
2004
Corpus ID: 44021499
In this paper, we present an integrated Coulter counter that applies a liquid aperture. The Coulter aperture is defined by a non…
Expand
Highly Cited
2003
Highly Cited
2003
Analysis of light scattering in amorphous Si:H solar cells by a one‐dimensional semi‐coherent optical model
J. Krč
,
F. Smole
,
M. Topič
2003
Corpus ID: 55250612
A one‐dimensional semi‐coherent optical model for thin‐film solar cells is presented. The optical circumstances at flat…
Expand
By clicking accept or continuing to use the site, you agree to the terms outlined in our
Privacy Policy
(opens in a new tab)
,
Terms of Service
(opens in a new tab)
, and
Dataset License
(opens in a new tab)
ACCEPT & CONTINUE