DICING

In cryptography, DICING is a stream cypher algorithm developed by Li An-Ping. It has been submitted to the eSTREAM Project of the eCRYPT network.
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Topic mentions per year

1982-2017
051019822017

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2013
2013
In order to analyze effect of the dicing process on the GaN epitaxial layer, the GaN-wafer is cut in sizes of the 0.7 mm square… (More)
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2009
2009
The concept of 3D integration aims at low cost and high yield processes. For this reason, cleanliness is a concern in process… (More)
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2006
2006
The optical wafer level packaging, developed by Schott Advanced Packaging, consists of a Silicon wafer, comprising the optical… (More)
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2006
2006
Thin wafers of 100-/spl mu/m thickness laminated with die-attach film (DAF) was diced using a standard sawing process and… (More)
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2006
2006
The usage of die attach film (DAF) is rapidly growing propelled by stacked die and 3 dimensional packaging. The die attach film… (More)
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2006
2006
We proposed and demonstrated a method for reconstructing waveguide portions that were removed when dicing 45/spl deg/ mirrors… (More)
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2005
2005
In recent years, the volume of thinned silicon and bumped silicon wafers have increased dramatically. The push to thinner silicon… (More)
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2005
2005
There exists an ever-increasing demand for piezoelectric and electrostrictive sensors and actuators fabricated with high levels… (More)
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2005
2005
DICING is a synchronous stream cipher submitted to the ECRYPT stream cipher project. Two versions of the cipher actually exist… (More)
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2003
2003
A slice of silicon less than 200 /spl mu/m in thickness is needed for IC card wafers. Dicing the wafer with a grinding wheel is… (More)
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