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ARHGEF5 wt Allele

Known as: P60, TIM1, GEF5 
Human ARHGEF5 wild-type allele is located within 7q33-q35 and is approximately 25 kb in length. This allele, which encodes Rho guanine nucleotide… 
National Institutes of Health

Related topics

Related topics

5 relations
7q33-q35Homo sapiensRho Guanine Nucleotide Exchange Factor 5Signal Transduction

Broader (1)

ARHGEF5 gene

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2016
2016
Improved router & server OPEX, acoustics and leakage power through advancements in ASIC / CPU design
Increasing thermal demands for high-end server CPUs and Router/Switch ASICs require increased performance for the air-cooled… 
2015
2015
Performance evaluation of thermal interface material (TIM1) in FCBGA+HS package using Automatic Test Equipment (ATE) tester and package reliability tests
Thermal interface materials (TIM) are used in flip-chip BGA packages between the die and the heat spreaders (TIM1) and the heat… 
2014
2014
Engineered thermal interface material
The power dissipation and device junction temperature control in high end processors, stacked and hybrid packages, test and burn… 
2013
2013
Thermal Resistance and Heat Spreading Characterization Platform for Concentrated Photovoltaic Cell Receivers
Concentrated photovoltaics (CPV) focus the sunlight on a cell area smaller than the aperture area, making the use of highly… 
2012
2012
Lineage-specific evolution of T-cell immunoglobulin and mucin domain 1 gene in the primates
T-cell immunoglobulin domain and mucin domain containing protein 1 (TIM1), also known as a cellular receptor for hepatitis A… 
2009
2009
Impact of temperature-dependent die warpage on TIM1 thermal resistance in field conditions
The evolution of microprocessor architectures has driven semiconductor manufacturers making transition from ceramic to organic… 
2009
2009
Interaction between TIM1 and TIM2 for mechanical robustness of integrated heat spreader
Integrated Heat Spreader (IHS) lids are increasingly being used in flip-chip package technology to enhance power and thermal… 
2008
2008
Thermal modeling for warpage effects in organic packages
INTRODUCTION Maintaining the integrity of the heat dissipation path for high end microelectronic devices has become increasingly… 
Review
2008
Review
2008
Meeting thermal performance and reliability challenges for a thermally enhanced ball grid array package (TEBGA)
  • Q. Qi
  • International Conference on Electronic Packaging…
  • 2008
  • Corpus ID: 10938346
For devices with challenging power management requirement, thermally enhanced ball grid array package (TEBGA) offers a good… 
2008
2008
Transient thermal characterization with applications to optimized thermal packaging of multi-core microprocessors
As the increase of power densities became the primary constraint for semiconductor industry to sustain the Moore's law for… 
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