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ACF
Advanced Component Framework (ACF) is a C++ component framework created by ImagingTools. Using the built-ACF Compositor tool, the internal…
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Application framework
C++
Component-based software engineering
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2012
Highly Cited
2012
Fe-nanoparticles dispersed carbon micro and nanofibers: Surfactant-mediated preparation and application to the removal of gaseous VOCs
Mekala Bikshapathi
,
Shiv Singh
,
Bhaskar Bhaduri
,
G. Mathur
,
Ashutosh Sharma
,
N. Verma
2012
Corpus ID: 38957290
2011
2011
Modeling electricity spot prices - Combining mean-reversion, spikes and stochastic volatility
Klaus Mayer
,
Thomas Schmid
,
Florian Weber
2011
Corpus ID: 13705015
Starting with the liberalization of electricity trading, this market grew rapidly over the last decade. However, while spot and…
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2010
2010
Realistic Workload Modeling and Its Performance Impacts in Large-Scale eScience Grids
Hui Li
IEEE Transactions on Parallel and Distributed…
2010
Corpus ID: 18826740
Grid computing proves to be a successful paradigm for large-scale distributed data processing, and global eScience grids have…
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2008
2008
Electroless copper deposition on a pitch-based activated carbon fiber and an application for NO removal
J. Byeon
,
Hee-Seung Yoon
,
K. Yoon
,
S. Ryu
,
Jungho Hwang
2008
Corpus ID: 49574179
2007
2007
Modeling and Mitigation of Narrowband Interference for Transmitted-Reference UWB Systems
Y. Alemseged
,
K. Witrisal
IEEE Journal on Selected Topics in Signal…
2007
Corpus ID: 14737302
Transmitted-reference ultra-wideband (TR-UWB) systems, in conjunction with autocorrelation-receivers (AcR), can collect all…
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Highly Cited
2005
Highly Cited
2005
To Appear in the Astrophysical Journal Letters Preprint typeset using L ATEX style emulateapj v. 6/22/04 DEFINITIVE IDENTIFICATION OF THE TRANSITION BETWEEN SMALL- TO LARGE-SCALE CLUSTERING FOR LYMAN…
2005
Corpus ID: 15065648
Highly Cited
2005
Highly Cited
2005
Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
W. Kwon
,
M. Yim
,
K. Paik
,
S. Ham
,
Soon-Bok Lee
2005
Corpus ID: 15021750
a Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejon 305-701, South…
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Highly Cited
2003
Highly Cited
2003
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications
C. Yin
,
M. Alam
,
Y. Chan
,
C. Bailey
,
Hua Lu
Microelectronics and reliability
2003
Corpus ID: 1952493
2003
2003
Behaviour of anisotropic conductive joints under mechanical loading
C. W. Tan
,
Y. Chan
,
N. H. Yeung
Microelectronics and reliability
2003
Corpus ID: 19002425
2003
2003
The effect of sampling jitter in OFDM systems
K. Manoj
,
G. Thiagarajan
IEEE International Conference on Communications…
2003
Corpus ID: 7587200
In this paper we study the effect of random jitter in the sampling circuit at the receiver in an OFDM communication system. We…
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