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ACF complex

Known as: ACF 
The Drosophila gene Acf1 encodes ATP-dependent chromatin assembly factor large subunit, a component of the chromatin assembly complex involved in… 
National Institutes of Health

Related topics

Related topics

3 relations
ACF complex locationDrosophila <fruit fly, genus>ISWI protein

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Analysis of trapped conductive microspheres in LCD FOG Anisotropic Conductive Film bonding
FOG(Flexible Printed Circuit On Glass) ACF(Anisotropic Conductive Film) bonding achieves electric conductivity interconnection by… 
2014
2014
A study on nanofiber anisotropic conductive films (ACFs) for fine pitch chip-on-glass (COG) interconnections
As pitch and space get finer in COG package, interconnection problems such as short circuit or open open circuit have been raised… 
2012
2012
Room temperature removal of NO by activated carbon fibres loaded with urea and La2O3
In this paper, catalytic samples of 10, 20, 30, 40 and 50% (w/w) urea/activated carbon fibre (AFC), 10% urea–5% La2O3/ACF, 10… 
2012
2012
Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly
New solder anisotropic conductive films (ACFs) consist of a thermosetting polymer resin and fine solder balls instead of the… 
2011
2011
Lifetime Estimation of an ACF in Navigation (March 2010)
Recently, liquid crystal display (LCD) panels have become very important components for portable electronics. In the high-density… 
2009
2009
Mi2β Shows Chromatin Enzyme Specificity by Erasing a DNase I-hypersensitive Site Established by ACF*
ATP-dependent chromatin-remodeling enzymes are linked to changes in gene expression; however, it is not clear how the multiple… 
2009
2009
Experimental analysis on the mechanism of moisture induced interface weakening in ACF package
In this paper, we have determined the influence of moisture absorption to the adhesion property of ACF for flip chip… 
2007
2007
Wafer Level Packages (WLPs) using Pre-Applied Anisotropic Conductive Films (ACFs)
Wafer level package (WLP) is one of the promising packaging technologies due to its advantages such as fewer processing steps… 
2006
2006
Study of several key reliability problems of COG/ACF interconnect in LCD module
Liquid crystal display (LCD) has been widely used in various electronic products. Chip-on-glass (COG)/anisotropic conductive film… 
2004
2004
Development on wafer level anisotropic conductive film for flip-chip interconnection
With the fast growth of multimedia, the packaging has to satisfy high interconnection density, high data throughput… 
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