• Corpus ID: 138140614

EFFECT OF SiO_2 NANO-PARTICLES ON ADHESION STRENGTH OF COPPER CONDUCTIVE ADHESIVES

@inproceedings{Tongxiang2005EFFECTOS,
  title={EFFECT OF SiO\_2 NANO-PARTICLES ON ADHESION STRENGTH OF COPPER CONDUCTIVE ADHESIVES},
  author={Li Tong-xiang},
  year={2005},
  url={https://api.semanticscholar.org/CorpusID:138140614}
}

• Li Tong-xiang
• Published 2005
• Materials Science

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO_2 nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145 ℃ for 2 h. The adhesion strength increased to 25 MPa when the SiO_2 nano-particles were doped. This result is… 

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO_2 nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145 ℃ for 2 h. The adhesion strength increased to 25 MPa when the SiO_2 nano-particles were doped. This result is attributed to the fact that SiO_2 nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.