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Abstract‘Black silicon’ (bSi) samples with surfaces covered in nanoneedles of length ~5 µm were fabricated using a plasma etching… Expand Mevalonate diphosphate decarboxylase (MDD; EC 22.214.171.124) catalyzes the irreversible decarboxylation of mevalonate diphosphate in… Expand This paper investigates properties of zinc porphyrin self-assembled monolayer (SAM) as a Cu diffusion barrier for advanced back… Expand This paper presents the effect of back grinding on the mechanical properties of the active side of the multilayered low-k stacked… Expand Copper (Cu)/low-dielectric constant (K) structures are desired choices for advanced integrated circuits (ICs) as the IC… Expand kehidupan. Banyak tumbuhan di Indonesia yang dapat dimanfaatkan secara
luas oleh masyarakat kita. Salah satu tanaman yang dapat… Expand Copper/Low-k structures are the desired choice for advanced integrated circuits (ICs) as the IC technology trends moving toward… Expand First, erosion removes C on convex slopes at rates of 1.4-2.7 g C m -2 yr -1 and 5-8 g C m -2 yr -1 at TV and BD, respectively… Expand Withdrawn. THE EFFECT OF PAD PROPERTIES ON THE PLANARITY IN A CMP PROCESS. Hoyoung Kim, Dong-Woon Park, Chang-Ki Hong, Woo-Sung… Expand