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Wedge bonding

Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is… Expand
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Papers overview

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2010
2010
The ultrasonic transversal force transmitted to a chip during ultrasonic bonding is derived from measurements of the vibration… Expand
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2009
2009
Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics… Expand
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2008
2008
Abstract The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature… Expand
2008
2008
We have developed 40-Gb/s traveling-wave electroabsorption-modulator-integrated distributed feedback laser (TW-EML) modules using… Expand
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2006
2006
Ultrasonic wedge bonding, which can be done at room temperature, is widely used in microelectronic package. It is primarily used… Expand
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2005
2005
  • K. Choi, J. Lee, +4 authors J. Kim
  • Proceedings Electronic Components and Technology…
  • 2005
  • Corpus ID: 31246836
TWEAM modulator modules optimized in 40 GHz and 60 GHz band, respectively, were developed. The bandwidth at the operating… Expand
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2005
2005
Abstract Chip on board wire bonding presents challenges to modern wire bonding technology which include smaller, closely spaced… Expand
2005
2005
Copper wire bonding is an alternative interconnection technology promising cost savings compared to gold wire bonding and better… Expand
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2001
2001
Organic printed circuit boards (PCBs) with Au/Ni plates on bond pads are widely used in chip-on-board (COB), ball grid array (BGA… Expand
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1999
1999
X-ray test results from a prototype 92 × 100 pixel array detector (PAD) for use in rapid time-resolved X-ray diffraction studies… Expand
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