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Wedge bonding

Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is… Expand
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Papers overview

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2013
2013
Driven by applications in the field of renewable energy, power distribution, consumer electronics and the automotive industry… Expand
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2012
2012
In semiconductor packaging, wire bonding is the main technology for electrical connections between chip and leadframe or… Expand
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2010
2010
The ultrasonic transversal force transmitted to a chip during ultrasonic bonding is derived from measurements of the vibration… Expand
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2009
2009
Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics… Expand
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2008
2008
Abstract The ultrasonic wedge bonding with d 25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature… Expand
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2006
2006
Ultrasonic wedge bonding, which can be done at room temperature, is widely used in microelectronic package. It is primarily used… Expand
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2005
2005
Copper wire bonding is an alternative interconnection technology promising cost savings compared to gold wire bonding and better… Expand
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2005
2005
During the large aluminum wire wedge bonding experiments, the PZT driver signal and the bonding shear strength was acquired as… Expand
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1999
1999
We have developed a configuration for diode-based electrostatic discharge structures that can be reliably placed under the metal… Expand
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1995
1995
The basis for our understanding of the ultrasonic bonding mechanism was first presented by B. Langenecker . This paper will… Expand
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