Wedge bonding

Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is… (More)
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Topic mentions per year

Topic mentions per year

1982-2016
024619822016

Papers overview

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2013
2013
Driven by applications in the field of renewable energy, power distribution, consumer electronics and the automotive industry… (More)
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2011
2011
Due to the high cost of gold, Cu-wire bonding is being used more and more on fine-pitch, high-pin-count IC devices. Medium-size… (More)
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2011
2011
In IC, wire bonding is the main technology for electrical connections between chip and leadframe or substrate. Gold wire bonding… (More)
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2011
2011
In semiconductor packaging, wire bonding is the main technology for electrical connections between chip and leadframe or… (More)
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2009
2009
Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics… (More)
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2006
2006
The joining mechanism of ultrasonic wedge bonding was investigated by chemical etching method. Compared to peeling-off method… (More)
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2006
2006
Ultrasonic wedge bonding, which can be done at room temperature, is widely used in microelectronic package. It is primarily used… (More)
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2005
2005
Copper wire bonding is an alternative interconnection technology promising cost savings compared to gold wire bonding and better… (More)
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2005
2005
During the large aluminum wire wedge bonding experiments, the PZT driver signal and the bonding shear strength was acquired as… (More)
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Review
2002
Review
2002
Wedge bonded ribbon wire has demonstrated the ability to provide better performance than round wire in many high performance… (More)
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