Skip to search formSkip to main contentSkip to account menu

Weaire–Phelan structure

Known as: Kelvin (disambiguation), Kelvin structure, Kelvin foam 
In geometry, the Weaire–Phelan structure is a complex 3-dimensional structure representing an idealised foam of equal-sized bubbles. In 1993, Trinity… 
Wikipedia (opens in a new tab)

Related topics

Related topics

7 relations
Crystal structureDodecahedronList of polygons, polyhedra and polytopesPatterns in nature

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Review
2017
Review
2017
Objective Measures of Electrophysiological Responses of Children with Idiopathic Autism Spectrum Disorder and Phelan-McDermid Syndrome to a Contrast-Reversing Checkerboard
The heterogeneity of autism presents many challenges in understanding the disorder. About one thousand genes are implicated in… 
2016
2016
Carbon Nanotube Contact Plug on Silicide for CMOS Compatible Interconnect
Carbon nanotube (CNT) filled contact plugs with silicide as the bottom electrode have been demonstrated in this letter. Nickel… 
2009
2009
Low-Resistance Carbon Nanotube Contact Plug to Silicon
We demonstrated the integration of carbon nanotubes (CNTs) as the contact plug to the Si MOSFET. A Ti silicide contact layer was… 
2008
2008
Electromigration of Cu-Sn-Cu micropads in 3D interconnect
There is significant interest in 3D interconnect technology due to its capability to provide fast, efficient inter-die… 
2008
2008
A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates
The Cu/SnAg double-bump structure is a promising candidate for fine-pitch flip-chip applications. In this study, the interfacial… 
2008
2008
A random Weaire-Phelan foam
Nowadays foams made of various materials (ceramics, metals or polymers) are used in many application areas. Properties such as… 
2007
2007
Ju n 20 06 Phase transition in a static granular system
We have measured the force needed by a rod to penetrate a static column of grains for different well-defined particle volume… 
2006
2006
Reliability Issues in Cu/low-k Structures Regarding the Initiation of Stress-Voiding or Crack Failure
Continuous down scaling of the interconnect dimensions led to the introduction of copper and low-k dielectric materials. The use… 
2005
2005
Intensive Zero-Exchange Shrimp Production Systems - Incorporation of Filtration Technologies to Improve Survival and Growth
Cost effective application of superintensive, biosecure marine production systems in the U.S. will depend upon proactive… 
1997
1997
Elastic-Plastic Behavior of a Kelvin Foam
By clicking accept or continuing to use the site, you agree to the terms outlined in our Privacy Policy (opens in a new tab), Terms of Service (opens in a new tab), and Dataset License (opens in a new tab)