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Vapour phase decomposition
Known as:
VPD
, Vapor phase decomposition
Vapour phase decomposition (VPD) is a method used in the semiconductor industry to improve the sensitivity of total-reflection X-ray fluorescence…
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Related topics
Related topics
3 relations
Broader (1)
Semiconductor device fabrication
Semiconductor industry
Wafer (electronics)
Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2018
2018
Responses of Hazelnut Trees to Organic and Conventional Managements in the Dryland
S. Özmen
Erwerbs-obstbau
2018
Corpus ID: 3275365
Hazelnut trees (Corylus avellana L.) give yields without any more reduction under dryland. However, it is not known how plant…
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2011
2011
Advanced Monitoring of Trace Metals Applied to Contamination Reduction of Silicon Device Processing
P. Maillot
,
C. Martin
,
A. Planchais
2011
Corpus ID: 2225391
The detrimental effects of metallic on certain key electrical parameters of silicon devices mandates the use of state‐of‐the‐art…
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Review
2005
Review
2005
Characterization and control of microcontamination for advanced technology nodes and 300-mm wafer processing: overview and challenges
B. Tseng
,
M. You
,
S. Hsin
IEEE transactions on device and materials…
2005
Corpus ID: 1081565
Advanced process technologies have been introducing many unseen problems on process yield and device reliability…
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2005
2005
Total reflection X-ray fluorescence spectrometry for the introduction of novel materials in clean-room production environments
D. Hellin
,
S. Gendt
,
J. Rip
,
Chris Vinckier
IEEE transactions on device and materials…
2005
Corpus ID: 36176452
In this paper, a number of case studies on the analysis of novel metallic contaminants on conventional and alternative substrates…
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2003
2003
Should We Analyze for Trace Metal Contamination at the Edge, Bevel, and Edge Exclusion of Wafers?
M. Beebe
,
C. Sparks
,
R. Carpio
2003
Corpus ID: 67812589
The edge, bevel, and edge exclusion area of a wafer has historically been difficult to monitor for trace metals. Standard trace…
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2002
2002
Study on Simple Transpiration Model and Fitted Measurement Time for Dominant Plant at Mudstone Area in Taiwan
Chang Chun-pin
,
Chang Jingcheng
,
Beaver Lin
2002
Corpus ID: 3108522
The dominant process in water relation of the whole plant is the absorption of large quantities of water from the soil, its…
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1999
1999
Analysis of light elements on Si wafer by vapor-phase decomposition/total reflection X-ray fluorescence.
M. Yamagami
,
M. Nonoguchi
,
+7 authors
S. Ikeda
1999
Corpus ID: 50874105
気相分解(VPD)を組み合わせた全反射蛍光X線分析(TXRF), VPD/TXRF法によって, Siウェハー上の極微量Na及びAlの分析を行った. Na及びAlの高感度分析を行うために, W-Mα線を用いてTXRF測定を行った.従来のTXRF…
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1999
1999
Copper contamination effect on the reliability of devices in the BiCMOS technology
K. Low
,
M. Schwerd
,
H. Koerner
,
H. Barth
,
A. O'Neil
Advanced Lithography
1999
Corpus ID: 111039493
Copper (Cu) will be used to replace aluminum in the next generation metallization due to its low resistivity and high…
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1999
1999
Applications of total reflection X-ray fluorescence to analysis of VLSI micro contamination
B. Liou
,
Chung-Len Lee
International Conference on Microelectronic Test…
1999
Corpus ID: 56157012
This paper demonstrates the microcontamination analysis on wafers after they went through the conventional ULSI processing steps…
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1996
1996
Applications of surface analytical techniques for metals reduction in ion implantation
D. Downey
,
Zhiyong Zhao
,
G. Angel
,
R. Eddy
,
P. Sullivan
Proceedings of 11th International Conference on…
1996
Corpus ID: 58362220
Quadrupole and magnetic sector SIMS, total reflection X-ray fluorescence spectrometry (TXRF), vapor phase decomposition with both…
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