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Through-hole technology
Known as:
Radial-lead
, Through-hole
, THT
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Through-hole technology, also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the…
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Related topics
Related topics
31 relations
Antistatic bag
Board-to-board connector
Breadboard
Chip carrier
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2009
Highly Cited
2009
Node deployment in large wireless sensor networks: coverage, energy consumption, and worst-case delay
W. Y. Poe
,
J. Schmitt
Asian Internet Engineering Conference
2009
Corpus ID: 3787786
Node deployment is a fundamental issue to be solved in Wireless Sensor Networks (WSNs). A proper node deployment scheme can…
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2007
2007
Vertical Thermopiles Embedded in a Polyimide-Based Flexible Printed Circuit Board
H. Yousef
,
K. Hjort
,
M. Lindeberg
Journal of microelectromechanical systems
2007
Corpus ID: 20314050
A fabrication process for vertical thermopiles embedded in a 75-mum-thick polyimide foil has been developed for flexible printed…
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2007
2007
Analysis of Via Capacitance in Arbitrary Multilayer PCBs
M. Pajovic
,
Jinghan Yu
,
Dragan Milojkovic
IEEE transactions on electromagnetic…
2007
Corpus ID: 12303363
The signal layer transitions at regions of multilayer printed circuit boards, where high-speed signal lines switch between two…
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Review
2007
Review
2007
A PTH Barrel Stress Distribution Model and Associated PWB Design Factors
Jingsong Xie
,
Yu-Jie Huo
,
Yuan Zhang
IEEE transactions on components and packaging…
2007
Corpus ID: 32122362
The IPC methodology as an industry standard for plated through hole (PTH) reliability assessment considers the uniform thermal…
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Highly Cited
2005
Highly Cited
2005
Metal Membranes with Hierarchically Organized Nanotube Arrays
Won Bo Lee
,
M. Alexe
,
K. Nielsch
,
U. Gösele
2005
Corpus ID: 95865789
A simple and general method for fabricating structurally well-defined Au nanotube membranes has been developed. A 2-D perfect…
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Review
2004
Review
2004
Reliability issues for flip-chip packages
P. Ho
,
Guotao Wang
,
Min Ding
,
Jie-Hua Zhao
,
X. Dai
Microelectronics and reliability
2004
Corpus ID: 31058063
Review
1996
Review
1996
SOCIAL DESIRABILITY AND THE DISSOCIATIVE EXPERIENCES SCALE
D. Beere
,
M. Pica
1996
Corpus ID: 37328698
This study found no relationship between dissociativity and social desirability. In contrast to the assumptions of social…
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1991
1991
A visual cortex domain model and its use for visual information processing
I. Rybak
,
N. Shevtsova
,
L. Podladchikova
,
A. Golovan
Neural Networks
1991
Corpus ID: 10974042
1990
1990
Performance of the timed token scheme in MAP
On-ching Yue
,
C. Brooks
IEEE Transactions on Communications
1990
Corpus ID: 30819591
Two new analytic approximations are given for the mean delay in the timed token bus network specified in MAP (manufacturing…
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1972
1972
The operator equation
G. Pedersen
,
M. Takesaki
1972
Corpus ID: 118149066
Let H and K be bounded positive operators on a Hubert space, and assume that H is nonsingular. Then (i) there is at most one…
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