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Thermally conductive pad
Known as:
Thermal pad (computing)
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are a pre-formed square or rectangle of…
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Related topics
Related topics
5 relations
Central processing unit
Computer cooling
Integrated circuit
Thermal grease
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
Low thermal resistance thermal pad for power converter modules
T. Semenic
,
A. Bhunia
,
N. Gollhardt
,
G. Morris
,
R. Lukaszewski
International Conference on Power Electronics and…
2017
Corpus ID: 46777873
Thermal Interface Material (TIM) is used between power converter module base plate and a heat sink to minimize thermal contact…
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2016
2016
Platform for monitoring the temperature of power LED junction by using the embedded protection diode
D. Vuza
,
M. Vlădescu
European Conference on Artificial Intelligence
2016
Corpus ID: 9137396
The junction operating temperature of a power LED can be estimated by measuring with a thermocouple the temperature of the…
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2012
2012
Stress chip measurements of the internal package stress for process characterization and health monitoring
F. Schindler-Saefkow
,
F. Rost
,
+4 authors
S. Rzepka
13th International Thermal, Mechanical and Multi…
2012
Corpus ID: 14403261
The experimental observation of the actual thermo-mechanical weak points in microelectronics packages remains a big challenge…
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2012
2012
Thermal analysis of high power LED subassemblies for automotive front light application
G. Elger
,
H. Willwohl
,
J. Schug
4th Electronic System-Integration Technology…
2012
Corpus ID: 19367402
High power LEDs for front lighting have been introduced on the market during 2007 and cost effective solutions are still…
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2011
2011
Voiding Control for QFN Assembly
D. Herron
,
Yan Liu
,
N. Lee
2011
Corpus ID: 54676791
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a…
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2010
2010
Investigation on the efficiency of thermal relief shapes on different Printed Circuit Boards
I. Plotog
,
G. Vărzaru
,
R. Bunea
,
I. Busu
,
T. Cucu
,
P. Svasta
International Symposium for Design and Technology…
2010
Corpus ID: 35951173
As known, thermal relief is a technique used to separate soldering pads or plated through-hole vias from large copper planes in…
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2009
2009
Influence of reflow profile and Pb-free solder paste in minimizing voids for Quad Flat Pack No-lead (QFN) assembly
Harish Gadepalli
,
R. Dhanasekaran
,
S. Ramkumar
,
T. Jensen
,
E. Briggs
Electronic Components and Technology Conference
2009
Corpus ID: 24619729
Quad Flatpack No lead (QFN) packages have become a popular choice in electronics packaging due to its small form factor. They are…
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2009
2009
A study of tunable optical filters based on micro-ring structures
J. M. Huang
,
Yuan Yao
,
Z. Deng
International Symposium on Mechatronics and its…
2009
Corpus ID: 14978098
A tunable optical filter based on micro-ring structure is studied in the paper. The normalized energy expression is derived at…
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Review
2001
Review
2001
Recent advances in endpoint and in-line monitoring techniques for chemical-mechanical polishing processes
D. Stein
,
D. Hetherington
Microelectronic and MEMS Technologies
2001
Corpus ID: 94642220
We present a summary of the recent advances in endpoint and in-line monitoring techniques for chemical-mechanical polishing (CMP…
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2001
2001
Measurement techniques for low heat flux exposures to fire fighters protective clothing
R. Vettori
,
W. Twilley
,
D. Stroup
2001
Corpus ID: 113652269
A series of experiments were conducted to investigate measurement technologies that are necessary and appropriate for evaluating…
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