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Stencil printing
Stencil printing is the process of depositing solder paste on the printed wiring boards (PWBs) to establish electrical connections. It is immediately…
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2019
2019
Stencil Printing Process using Cross Viscosity Model
M. S. Rusdi
,
M. Z. Abdullah
,
+8 authors
Damian G. Santhanasamy
2019
Corpus ID: 121166476
1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 2 School…
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2014
2014
A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)
C. Ehrhardt
,
M. Hutter
,
H. Oppermann
,
K. Lang
Electronic Components and Technology Conference
2014
Corpus ID: 25192406
This Paper reports an emerging lead-free joining technology for high temperature application, which can be used for operating…
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Review
2013
Review
2013
FINE TUNING THE STENCIL MANUFACTURING PROCESS AND OTHER STENCIL PRINTING EXPERIMENTS
C. Shea
,
R. Whittier
2013
Corpus ID: 55861630
Previous experimentation on a highly miniaturized and densely populated SMT assembly revealed the optimum stencil alloy and flux…
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2006
2006
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application
Jong‐Woong Kim
,
Dae-Gon Kim
,
Seung-Boo Jung
Microelectronics and reliability
2006
Corpus ID: 39437768
2006
2006
Area array encapsulation with stencil printing and microwave curing
R. Hubbard
,
Z. Fathi
,
I. Ahmad
,
J. Schake
,
R. Zhao
,
B. Toleno
Electronic Components and Technology Conference
2006
Corpus ID: 27455167
An alternative to the transfer molding of area array packages is the stencil printing of the encapsulant followed by a variable…
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2005
2005
Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Dae-Gon Kim
,
Seung-Boo Jung
2005
Corpus ID: 53331843
The interfacial microstructure of Sn–0.7Cu solder with ENIG (electroless Ni/immersion Au) was studied using scanning electron…
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2004
2004
Long time reliability study of soldered flip chips on flexible substrates
B. Pahl
,
C. Kallmayer
,
R. Aschenbrenner
,
H. Reichl
Microelectronics and reliability
2004
Corpus ID: 28561473
2002
2002
Bump formation for flip chip and CSP by solder paste printing
J. Kloeser
,
P. Coskina
,
R. Aschenbrenner
,
H. Reichl
Microelectronics and reliability
2002
Corpus ID: 20934657
2000
2000
Simulation of the Stencil Printing Process
C. Bailey
,
K. Pericleous
2000
Corpus ID: 138238804
This paper describes the application of advanced Computational Fluid Dynamics (CFD) methods to model the stencil printing process…
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1994
1994
Stencil printing of ion-selective membranes on flexible planar sensor arrays for cardiovascular applications
S. Ufer
,
C. Mundt
,
B. Ash
,
R. Buck
Proceedings of 16th Annual International…
1994
Corpus ID: 61112994
Planar ion-selective potentiometric sensor arrays have been fabricated on flexible substrates for cardiovascular research using a…
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