Stencil printing

Stencil printing is the process of depositing solder paste on the printed wiring boards (PWBs) to establish electrical connections. It is immediately… (More)
Wikipedia

Topic mentions per year

Topic mentions per year

1998-2017
051019982017

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Nowadays, stencil printing process has become one of the most crucial steps in the continuously developing reflow soldering… (More)
  • figure 1
  • figure 4
  • figure 2
  • figure 5
  • figure 6
Is this relevant?
2009
2009
Uneven solder mask thickness or other artifacts on PCBs can keep the stencil away from the PCB during stencil printing, which… (More)
  • figure 4
  • figure 2
  • figure 3
  • figure 5
  • figure 6
Is this relevant?
2008
2008
This paper presents a comparison study for the optimization of stencil printing operations using hybrid intelligence technique… (More)
  • figure 1
  • figure 2
  • table 1
  • figure 3
  • figure 4
Is this relevant?
2008
2008
This paper presents a neural network model for the stencil printing process (SPP) in surface-mount technology (SMT) manufacturing… (More)
  • figure 1
  • figure 2
  • figure 3
  • table I
  • figure 4
Is this relevant?
2005
2005
In this paper solder paste printing is reported at sub 100mum pitch using Pb-free solder paste with IPC type-6 (15-5|im) particle… (More)
  • figure 1
  • table 2
  • figure 4
  • table 1
  • figure 5
Is this relevant?
2004
2004
This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 lead-free… (More)
  • figure 1
  • figure 2
  • figure 4
  • figure 3
  • figure 5
Is this relevant?
2004
2004
Stencil printing continues to be the dominant method of solder deposition in high-volume surface-mount assembly. Control of the… (More)
  • figure 1
  • table I
  • table III
  • table II
  • figure 2
Is this relevant?
2004
2004
For a successful implementation of wafer pre-applied underfill application, an appropriate underfill coating process has to be… (More)
  • figure 1
  • figure 2
  • table 1
  • figure 3
  • figure 6
Is this relevant?
2003
2003
The MAT21 project, funded by the British funding agency, EPSRC, aims to integrate microsystems and flip-chip technology into… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • figure 5
Is this relevant?
1998
1998
Stencil printing of solder paste with sinusoidally vibrated squeegee is a new technique developed in recent years used for the… (More)
  • table I
  • figure 3
  • figure 1
  • figure 2
  • figure 4
Is this relevant?