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Stencil printing

Stencil printing is the process of depositing solder paste on the printed wiring boards (PWBs) to establish electrical connections. It is immediately… Expand
Wikipedia

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
1 School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia 2 School… Expand
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2016
2016
Display Omitted The stencil printing parameters for a micro-BGA package were robustly optimized.Three optimization methods were… Expand
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2014
2014
This Paper reports an emerging lead-free joining technology for high temperature application, which can be used for operating… Expand
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Highly Cited
2008
Highly Cited
2008
  • T. Tsai
  • Comput. Ind. Eng.
  • 2008
  • Corpus ID: 559968
This paper presents a comparison study for the optimization of stencil printing operations using hybrid intelligence technique… Expand
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2007
2007
This paper presents the results of a packaging process based on the stencil printing of isotropic conductive adhesives (ICAs… Expand
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2005
2005
The soldering problems in surface mount assembly can represent considerable production cost increases and yield loss. About 60… Expand
Highly Cited
2004
Highly Cited
2004
Abstract Stencil printing remains the technology route of choice for flip chip bumping because of its economical advantages over… Expand
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2002
2002
Abstract Area array packages (flip chip, CSP and BGA) require the formation of bumps for the board assembly. Since the… Expand
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1998
1998
Stencil printing of solder paste with sinusoidally vibrated squeegee is a new technique developed in recent years used for the… Expand
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1998
1998
A novel technique of fabricating MCM-L compatible integrated resistors on large area substrates is presented. Electroless plated… Expand