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Small Outline Integrated Circuit

Known as: Small-outline integrated circuit, SSOP, SOIC-8 
A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an… Expand
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2019
2019
In the semiconductor manufacturing industry, package chip-out is a common defect frequently encountered in trim and form (T/F… Expand
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2018
2018
The recently introduced inkjet printing technology with ambient sintering is here investigated for the fabrication of epidermal… Expand
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2013
2013
The shift of electronics industry towards the use of lead-free solders in components manufacturing brought also the challenge of… Expand
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Highly Cited
2012
Highly Cited
2012
Sidelobe suppression, or out-of-band emission reduction, in multicarrier systems is conventionally achieved via time-domain… Expand
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Highly Cited
2008
Highly Cited
2008
  • B. Chen
  • IEEE Power Electronics Specialists Conference
  • 2008
  • Corpus ID: 33570947
Half-bridge gate drivers have been widely used in a variety of applications, such as motor drives, power supplies, and plasma… Expand
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2007
2007
QFN demand has dramatically increased during the past 3 years. It has been replacing older packages like SOIC and TSSOP mainly… Expand
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2005
2005
Whilst the impact of poor component solderability on lead-containing solder systems is well understood, little information is… Expand
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1999
1999
Finite element modeling suggests that the thermal performance of plastic and ceramic packages could be significantly improved… Expand
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1997
1997
Fiore, Thomas A.; Curtin, Thomas R. Public and Private School Principals in the United States: A Statistical Profile, 1987-88 to… Expand
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