Small Outline Integrated Circuit

Known as: Small-outline integrated circuit, SSOP, SOIC-8 
A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an… (More)
Wikipedia

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Highly Cited
2012
Highly Cited
2012
Sidelobe suppression, or out-of-band emission reduction, in multicarrier systems is conventionally achieved via time-domain… (More)
  • figure 1
  • figure 3
  • figure 4
  • table I
  • figure 2
Is this relevant?
2011
2011
Copper (Cu) bond wires are increasingly used in semiconductor components to replace gold (Au) bond wires, and applications for… (More)
  • figure 1
  • figure 2
  • table 1
  • figure 3
  • table 4
Is this relevant?
2011
2011
Failure Mode, Mechanism and Effect Analysis (FMMEA) is a reliability analysis method which is used to study possible failure… (More)
  • figure 2
  • figure 3
Is this relevant?
2010
2010
This study reports the packaging effects of a small-outline package (SOP) on overall electrical characteristics of RFICs. The… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • table 2
Is this relevant?
2008
2008
  • Baoxing Chen
  • IEEE Power Electronics Specialists Conference
  • 2008
Half-bridge gate drivers have been widely used in a variety of applications, such as motor drives, power supplies, and plasma… (More)
  • figure 1
  • figure 3
  • figure 2
  • figure 5
  • figure 6
Is this relevant?
2008
2008
We demonstrated a fully integrated isolated dc-dc converter using coreless micro-transformers. The transformers are switched… (More)
  • figure 1
  • figure 2
  • figure 3
  • figure 4
  • table I
Is this relevant?
2007
2007
QFN demand has dramatically increased during the past 3 years. It has been replacing older packages like SOIC and TSSOP mainly… (More)
  • figure 1
  • figure 2
  • figure 2
  • figure 3
  • figure 5
Is this relevant?
2005
2005
In this study, thermal cycling test from -40/spl deg/C to 125/spl deg/C with 1 hour per cycle for Sn/sub -3.8/Ag/sub -0.7/Cu… (More)
  • figure 1
  • table 2
  • figure 3
  • figure 4
  • table 1
Is this relevant?
2003
2003
The distribution of HLA-DRB1 alleles and DQB1 alleles in 583 individuals of three different caste groups of North India was… (More)
  • table 1
  • table 3
  • table 2
  • table 6
  • table 9
Is this relevant?
1999
1999
Finite element modeling suggests that the thermal performance of plastic and ceramic packages could be significantly improved… (More)
  • table 1
  • figure 1
  • figure 2
  • figure 3
  • figure 4
Is this relevant?