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Plated wire memory
Plated wire memory is a variation of core memory developed by Bell Laboratories in 1957. Its primary advantage was that it could be machine-assembled…
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7 relations
Broader (2)
Computer memory
Non-volatile memory
DF-224
Ferrite (magnet)
LGM-30 Minuteman
NSSC-1
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2017
2017
PLATED COBALT-BORON CATALYST ON HIGH SURFACE AREA TEMPLATES FOR HYDROGEN GENERATION FROM SODIUM BOROHYDRIDE
US 20090196821A
2017
Corpus ID: 52199869
The invention provides a catalyst-coated nickel template including a) an open-cell nickel foam having within it pores defined by…
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2012
2012
Cohesion Property of Electroless Plated Ni-P Coating on Fiber Bragg Grating
L. Fang
,
Peng Zhang
,
A. Tang
,
S. Xue
2012
Corpus ID: 138392018
2009
2009
EFFECT OF PRETREATMENT ON ADHESION OF ELECTROLESS PLATED Ni-P COATINGS ON SINTERED Nd-Fe-B PERMANENT MAGNET
S. Chen
,
Zhang Wei
,
Yan Chuanwei
2009
Corpus ID: 138582331
As it is well recognized that pretreatment is a key procedure for reaching a proper adhesion of an electroless Ni-P coating on a…
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2007
2007
Wafer Level Packages (WLPs) using Pre-Applied Anisotropic Conductive Films (ACFs)
K. Paik
,
H.-Y Son
,
C. Chung
International Conference on Polymers and…
2007
Corpus ID: 41514714
Wafer level package (WLP) is one of the promising packaging technologies due to its advantages such as fewer processing steps…
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2004
2004
Conductiveadhesives containing Ag-Sn alloys as conductive filler
K. Suzuki
,
Y. Shirai
,
N. Mizumura
,
M. Komagata
4th IEEE International Conference on Polymers and…
2004
Corpus ID: 36555053
Ag filled isotropic conductive adhesives (ICAs) have been investigated as pmmising altematives for lead-containing soldm in…
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2004
2004
Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
M. Hutter
,
F. Hohnke
,
H. Oppermann
,
M. Klein
,
G. Engelmann
Proceedings. 54th Electronic Components and…
2004
Corpus ID: 38801549
Flip chip assembly experiments using small electroplated Au/Sn bumps, i.e. bumps of 50 /spl mu/m in diameter and less, are…
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1982
1982
Fabrication Of Electroless Nickel-Plated Mirrors On Alnico Substrates
E. Phillips
Optics & Photonics
1982
Corpus ID: 137489403
Spherical metal mirrors have been fabricated by grinding and polishing the desired curvature in electroless nickel deposited over…
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1969
1969
Magnetic-Field Design Considerations for a Plated-Wire Memory
H. Lotsch
IEEE transactions on computers
1969
Corpus ID: 39326959
Permeable keepers are used in a plated-wire memory to reduce the adjacent bit interference and the current requirement…
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1968
1968
An 80-Nanosecond plated-wire store for a time-compression multiplex transmission system
J. Heightley
,
A. Perneski
1968
Corpus ID: 214800202
A 12-MHz 6500-bit plated-wire memory system is described and properties discussed that show feasibility for application in a time…
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1967
1967
High-Speed Plated-Wire Memory System
S. Waaben
IEEE Transactions on Electronic Computers
1967
Corpus ID: 5731692
The plated-wire memory, combined with functional circuit integration, is a strong contender for economic, high-speed, large…
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