Information Amendment: Information Not Covered Under Modules 2 to 5

 
National Institutes of Health

Topic mentions per year

Topic mentions per year

1990-2017
01219902017

Papers overview

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Review
2017
Review
2017
This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future… (More)
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2017
2017
Supercapacitors or Electrochemical Double Layer Capacitors, briefly named EDLC, are very promising energy storage components. The… (More)
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2013
2013
A numerical model has been developed to simulate coupled thermal and electrical energy transfer processes in a thermoelectric… (More)
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2010
2010
Thermoelectric modules (TEMs) are solid-state devices used for cooling, heating and power generation. An experimental apparatus… (More)
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2005
2005
In this paper, the Pade approximation technique is first applied to the conventional eigenmode expansion method (EEM) for… (More)
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1992
1992
  • S. Seinecke
  • CompEuro 1992 Proceedings Computer Systems and…
  • 1992
Presents a basic scheme for water-cooled multichip modules (MCMs). Multichip modules are a very effective approach to achieve… (More)
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Review
1990
Review
1990
The characteristics of multichip modules (MCMs) with TFML are reviewed. The Thomson Hybrides MCMP five-layer technology is then… (More)
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