Information Amendment: Information Not Covered Under Modules 2 to 5

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future… (More)

Supercapacitors or Electrochemical Double Layer Capacitors, briefly named EDLC, are very promising energy storage components. The… (More)

A numerical model has been developed to simulate coupled thermal and electrical energy transfer processes in a thermoelectric… (More)

Thermoelectric modules (TEMs) are solid-state devices used for cooling, heating and power generation. An experimental apparatus… (More)

In this paper, the Pade approximation technique is first applied to the conventional eigenmode expansion method (EEM) for… (More)

Presents a basic scheme for water-cooled multichip modules (MCMs). Multichip modules are a very effective approach to achieve… (More)

The characteristics of multichip modules (MCMs) with TFML are reviewed. The Thomson Hybrides MCMP five-layer technology is then… (More)