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Fibre Channel over IP

Known as: FCIP, Fiber Channel over IP, Fibre Channel of IP 
Fibre Channel over IP (FCIP or FC/IP, also known as Fibre Channel tunneling or storage tunneling) is an Internet Protocol (IP) created by the… 
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Related topics

Related topics

7 relations
Fibre ChannelFibre Channel over EthernetHyperSCSIISCSI

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Comparison of Three Different Linking Procedures between Norm-Referenced Test and Criterion-Referenced Test
Previous studies (e.g., [4]) mainly focused on comparing different equating methods used on two parallel or alternative tests… 
2014
2014
Assessing Cost-Effectiveness of the Conservation Reserve Program and its Interaction with Crop Insurance Subsidies
Strong demand for agricultural commodities, high crop prices and pressure to reduce government budget deficits heighten the need… 
2008
2008
Void Formation Study of Flip Chip in Package Using No-Flow Underfill
The advanced flip chip in package (FCIP) process using no-flow underfill material for high I/O density and fine-pitch… 
2007
2007
Assembly Yields Characterization of High IO Density, Fine Pitch Flip Chip in Package Using No-Flow Underfill
The application of no-flow underfills for high IO density, fine-pitch, flip chip in package (FCIP) applications is analyzed. A… 
Review
2006
Review
2006
High performance data transfer
High Performance Data Transfer is a core requirement of many Supercomputing applications. From basic FTP file transfers to P2P or… 
2006
2006
Identifying Follow-Correlation Itemset-Pairs
An association rule ArarrB is useful to predict that B will likely occur when A occurs. This is a classical association rule. In… 
2004
2004
Finding Fibre Channel over TCP/IP (FCIP) Entities Using Service Location Protocol version 2 (SLPv2)
This document defines the use of Service Location Protocol version 2 (SLPv2) by Fibre Channel over TCP/IP (FCIP) Entities… 
Review
2002
Review
2002
High density packaging in 2010 and beyond
As microsystems continue to move towards higher speed and microminiaturization, the demands for interconnection density both on… 
2001
2001
Wettability of electroless Ni in the under bump metallurgy with lead free solder
This study investigates the wettability of several lead-free solders, including Sn, Sn−Ag, and Sn−Bi, on electroless Ni (EN) with… 
1997
1997
Equating Multiple Tests via an IRT Linking Design: Utilizing a Single Set of Anchor Items with Fixed Common Item Parameters during the Calibration Process.
This study explores the relative merits of a potentially useful item response theory (IRT) linking design: using a single set of… 
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