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Fibre Channel over IP

Known as: FCIP, Fiber Channel over IP, Fibre Channel of IP 
Fibre Channel over IP (FCIP or FC/IP, also known as Fibre Channel tunneling or storage tunneling) is an Internet Protocol (IP) created by the… 
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Related topics

Related topics

7 relations
Fibre ChannelFibre Channel over EthernetHyperSCSIISCSI

Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2015
2015
Comparison of Three Different Linking Procedures between Norm-Referenced Test and Criterion-Referenced Test
Previous studies (e.g., [4]) mainly focused on comparing different equating methods used on two parallel or alternative tests… 
2012
2012
The role of crisis in family crisis intervention : Do crisis experience and crisis change matter ?
Evaluation studies of crisis intervention have focused on prevention of out-of-home placement of children or family functioning… 
2009
2009
Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill
The advanced flip-chip-in-package (FCIP) process technology, using no-flow underfill material for high I/O density (over 3000 I/O… 
2007
2007
Plasma Surface Modification and Impact on MSL Performance for Flip Chip Packaging
The effectiveness of "under-chip" plasma cleaning and its impact on moisture sensitivity level (MSL) performance for flip chip… 
2004
2004
Fibre Channel Over TCP/IP (FCIP)
Fibre Channel Over TCP/IP (FCIP) describes mechanisms that allow the interconnection of islands of Fibre Channel storage area… 
2004
2004
Securing Block Storage Protocols over IP
This document discusses how to secure block storage and storage discovery protocols running over IP (Internet Protocol) using… 
2004
2004
Finding Fibre Channel over TCP/IP (FCIP) Entities Using Service Location Protocol version 2 (SLPv2)
This document defines the use of Service Location Protocol version 2 (SLPv2) by Fibre Channel over TCP/IP (FCIP) Entities… 
2004
2004
The effect of end to end latency in a distributed storage area network on Microsoft Exchange Server 2003 performance - Part I
The ever increasing demand for fast and reliable data storage has caused dramatic changes in the storage model. The direct… 
Review
2002
Review
2002
High density packaging in 2010 and beyond
As microsystems continue to move towards higher speed and microminiaturization, the demands for interconnection density both on… 
2001
2001
Wettability of electroless Ni in the under bump metallurgy with lead free solder
This study investigates the wettability of several lead-free solders, including Sn, Sn−Ag, and Sn−Bi, on electroless Ni (EN) with… 
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