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Die preparation

Known as: Semiconductor-die cutting, Wafer mounting 
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die… Expand
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
This paper demonstrates, for the first time, a Wireless Local Area Network (WLAN) radio frequency (RF) front end module (FEM… Expand
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2014
2014
This paper presents a D-band PA on 28nm CMOS demonstrating excellent gain power dissipation and bandwidth tradeoffs. It features… Expand
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2011
2011
Die Bestrebungen fur eine Regierungsreform in der Schweiz lassen sich weit zuruckverfolgen, sie fuhrten aber zu keinen… Expand
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2008
2008
A low-cost 1.2 V 5.14 mW phase-lock loop (PLL) quadrature frequency synthesizer compliant with the 2.4 GHz ZigBee standard (IEEE… Expand
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2005
2005
Unlike conventional laser-based technologies, the water jet guided laser does not generate heat damage and contamination is also… Expand
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2005
2005
An investigation on the process-induced warpage during the array-molding process of QFN packages was conducted both… Expand
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2005
2005
In einer unlangst erschienenen Arbeit berichten DEI~IEREC und SiTINA (1925) fiber Untersuchungen betreffend eine chemische… Expand
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2002
2002
An evaluation of the ASML ATHENA alignment system was performed using marks placed in the scribeline of an Intel test chip used… Expand
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2000
2000
Ethers are very important compounds in organic synthesis. Phenols can be protected as methyl ethers in 'multistep synthes is to… Expand
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