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Die preparation

Known as: Semiconductor-die cutting, Wafer mounting 
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die… 
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Papers overview

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2014
2014
This paper demonstrates, for the first time, a Wireless Local Area Network (WLAN) radio frequency (RF) front end module (FEM… 
2011
2011
Die Bestrebungen fur eine Regierungsreform in der Schweiz lassen sich weit zuruckverfolgen, sie fuhrten aber zu keinen… 
2009
2009
The uniformity of polymer melt flow in micro extrusion die determines the quality of products directly. It is the base of… 
2008
2008
Von allen Polymerisationsmethoden bietet die katalytische Polymerisation die vielseitigsten M glichkeiten zur Mikro… 
2005
2005
An investigation on the process-induced warpage during the array-molding process of QFN packages was conducted both… 
2002
2002
Gallium arsenide (GaAs) wafer manufacturing often requires the reduction in overall wafer thickness in order to allow the device… 
2000
2000
Ethers are very important compounds in organic synthesis. Phenols can be protected as methyl ethers in 'multistep synthes is to… 
1998
1998
ZusammenfassungDas vernarbende Pemphigoid (VP) umfaßt eine Gruppe von Patienten mit einer chronischen, subepidermal… 
1958
1958