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Die preparation
Known as:
Semiconductor-die cutting
, Wafer mounting
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die…
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Die (integrated circuit)
Integrated circuit
Interposer
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Papers overview
Semantic Scholar uses AI to extract papers important to this topic.
2014
2014
Modeling, design and demonstration of multi-die embedded WLAN RF front-end module with ultra-miniaturized and high-performance passives
S. Sitaraman
,
Yuya Suzuki
,
+7 authors
R. Tummala
Electronic Components and Technology Conference
2014
Corpus ID: 5815569
This paper demonstrates, for the first time, a Wireless Local Area Network (WLAN) radio frequency (RF) front end module (FEM…
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2011
2011
Die Regierungsreform im Bund : in kleinen Schritten und auf einem engen Pfad, Inkrementalismus und Pfadabhängigkeit
T. Bär
2011
Corpus ID: 165724158
Die Bestrebungen fur eine Regierungsreform in der Schweiz lassen sich weit zuruckverfolgen, sie fuhrten aber zu keinen…
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2009
2009
Numerical simulation and experimental study of polymer micro extrusion flow
Danyang Zhao
,
Yifei Jin
,
Minjie Wang
,
Kai Li
,
M. Song
International Symposium on Mechatronics and its…
2009
Corpus ID: 14292804
The uniformity of polymer melt flow in micro extrusion die determines the quality of products directly. It is the base of…
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2008
2008
Katalytische Copolymerisation von polaren Vinylmonomeren H2CCHX
A. Berkefeld
,
S. Mecking
2008
Corpus ID: 98796770
Von allen Polymerisationsmethoden bietet die katalytische Polymerisation die vielseitigsten M glichkeiten zur Mikro…
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2005
2005
Experimental and numerical investigation on warpage of QFN packages induced during the array molding process
D.G. Yang
,
K. Jansen
,
L. Ernst
,
Zhang Gq
,
J. Beijer
,
J. Janssen
International Conference on Electronic Packaging…
2005
Corpus ID: 31305249
An investigation on the process-induced warpage during the array-molding process of QFN packages was conducted both…
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2004
2004
Theoretical analysis and optimisation of parameters in extrusion process of explosive cladded bimetallic rods
A. Milenin
,
S. Berski
,
G. Banaszek
,
H. Dyja
2004
Corpus ID: 73708692
2002
2002
A New Alternative for Temporary Wafer Mounting
D. Mould
,
J. Moore
2002
Corpus ID: 112945487
Gallium arsenide (GaAs) wafer manufacturing often requires the reduction in overall wafer thickness in order to allow the device…
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2000
2000
Microwave Enhanced Synthesis of Aromatic Methyl Ether.
A. Mitra
,
A. De
,
Nilay Karchaudhuri
2000
Corpus ID: 98751147
Ethers are very important compounds in organic synthesis. Phenols can be protected as methyl ethers in 'multistep synthes is to…
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1998
1998
Autoantigene des vernarbenden Pemphigoids und ihre pathogenetische Bedeutung
G. Kirtschig
Der Hautarzt
1998
Corpus ID: 29600710
ZusammenfassungDas vernarbende Pemphigoid (VP) umfaßt eine Gruppe von Patienten mit einer chronischen, subepidermal…
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1958
1958
Die infinitive im Ṛgveda
P. Sgall
1958
Corpus ID: 171151291
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