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Die preparation

Known as: Semiconductor-die cutting, Wafer mounting 
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die… 
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Papers overview

Semantic Scholar uses AI to extract papers important to this topic.
Review
2016
Review
2016
Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part of the packaging process… 
Review
2015
Review
2015
Practices of IC package reliability testing are reviewed briefly, and the application of transient thermal analysis is examined… 
2015
2015
We report on defects characterization and reduction as well as die strength enhancement using stealth dicing (SD) on high… 
2014
2014
A number of industries are developing new product-lines with innovative electronics packages that require low thermal resistance… 
2013
2013
Polycrystalline, high purity (99,995%) zinc ingot was subjected to KoBo type extrusion in room temperature. Material was extruded… 
2009
2009
The uniformity of polymer melt flow in micro extrusion die determines the quality of products directly. It is the base of… 
2005
2005
Unlike conventional laser-based technologies, the water jet guided laser does not generate heat damage and contamination is also… 
2005
2005
An investigation on the process-induced warpage during the array-molding process of QFN packages was conducted both… 
2002
2002
An evaluation of the ASML ATHENA alignment system was performed using marks placed in the scribeline of an Intel test chip used… 
1989
1989
Dieses Buch ist in erster Linie als ein Beitrag zur phanomenologi schen Aufklarung der mathematischen Erkenntnis gedacht. Pha…