Die preparation

Known as: Semiconductor-die cutting, Wafer mounting 
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die… (More)
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Topic mentions per year

Topic mentions per year

1998-2017
024619982017

Papers overview

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2017
2017
Heterogeneous integration is considered to be essential to maximal exploitation of the densification, performance and system cost… (More)
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2010
2010
Even today, school segregation continues to be understood as legitimate in Germany. Charting the discourse of learning disability… (More)
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Review
2009
Review
2009
A wide range of adhesives and coatings has been reported to enable wafer bonding practices that support applications leading to 3… (More)
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2006
2006
In order to simplify the processing complexity and cut down the manufacturing cost, a new wafer bonding technique using… (More)
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2006
2006
  • Grit Rudolph
  • Pflüger's Archiv für die gesamte Physiologie des…
  • 2006
 
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2005
2005
 
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2004
2004
A system-level environmental analysis of die casting based on aggregate national data and representative machine characteristics… (More)
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2004
2004
In order to lower the packaging cost and resolve the process complexity of MEMS fabrications, a new wafer-level post-process… (More)
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2004
2004
 
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1999
1999
  • Phillip G. Creter, Stephen H. Olster, Paul Solan
  • 1999
A quantitative analysis of thick film chip resistors is presented regarding design and construction. Critical reliability and… (More)
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