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Board level reliability studies have been performed on wafer level packages (WLP) with various solder ball alloys, underbump… Expand Since the employment of copper (Cu) column bump (with lead-free solder cap) interconnect offers flexibility in the aspect ratio… Expand Tested Al-5Co and Al-5Mg-5Co materials were manufactured using a common ingot metallurgy (IM) and rapid solidification (RS… Expand Currently, many medical devices are made of implantable metals such as 316LVM stainless steel. Electropolishing is a common… Expand An alternative processing method for superplastic magnesium alloys has been studied on the form of sheet of Mg–9Al–1Zn (AZ91) via… Expand principles, mineral processing IS now being al?plied to materIals ranging from ceramics and composites to superconductors. In… Expand Sprayforming is a promising route for production of highly segregation prone alloys such as the high y’ fraction nickel alloys… Expand A review is presented of the use of 4-methyl-2pentanone, bis(2- butoxyethyl)ether. and tributyl phosphate in extractive… Expand