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B little g super little a Ab:Titr:Pt:Ser/Plas:Qn

Known as: B petit g exposant petit a Ac:Titre:Temps ponctuel:Sérum/Plasma:Quantitatif, Bg^a Acs:Título:Punto temporal:Suero o Plasma:Qn, B küçük g süper küçük a Ab:Titr:Zml?:Ser/Plaz:Kant 
National Institutes of Health

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6 relations
AntibodiesBlood group antigen ABlood group antigen BPlas

Papers overview

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2018
2018
Performance study of SKIROC2/A ASIC for ILD Si-W ECAL
The ILD Si-W ECAL is a sampling calorimeter with tungsten absorber and highly segmented silicon layers for the International… 
2018
2018
Improving Solder Joint Reliability for PoP Packages in Current Mobile Ecosystem
Package on Package (PoP) has been an ideal choice for high end products in mobile ecosystem due to its high-density bandwidth… 
2017
2017
3 D Surface Reconstruction of a BGA Connector with Large Specular Highlights by Photometric Stereo
We propose to apply the Photometric Stereo method on small objects with a specular surface behavior, such as BGA (Ball Grid Array… 
2014
2014
Generalizing performance limitations of relay neurons: Application to Parkinson's disease
Relay cells are prevalent throughout sensory systems and receive two types of inputs: driving and modulating. The driving input… 
2011
2011
Characterization of the mechanical properties of actual solder joints using DIC
This paper presents the characterization of the elasto-plastic behavior of actual Sn-1.0wt.%Ag-0.5wt.%Cu (SAC105), Sn-3.0wt.%Ag-0… 
2011
2011
Laser를 이용한 3차원 BGA 높이 정밀 검사를 위한 방법
최근 전자제품의 초소형화에 따라, PCB 기판위의 부품의 집적도를 높이기 위해, 기존의 리드대신 부품 밑면에 볼이 격자형태로 배열되어 있는 BGA(Ball Grid Array… 
2010
2010
Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors
In this paper, the button shear tests of seven kinds of epoxy used for corner/edge bonding of BGA mezzanine connectors are… 
2009
2009
Head in pillow (HIP) and yield study on SIP and PoP assembly
This paper uses a statistical approach to simulate the yield loss due to HIP (head-in-pillow) based on experimental work… 
2008
2008
Improve the Reliability of BGA Solder Joint
Discuss the reliability of the BGA solder joints based on working experience and analyze the problems.Suggest some measures to… 
2005
2005
The Impact of Reflowing A Pbfree Solder Alloy Using A Tin / Lead Solder Alloy Reflow Profile On Solder Joint Integrity
The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS… 
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