Zinc whisker growth from electroplated finishes – a review

@article{Wu2013ZincWG,
  title={Zinc whisker growth from electroplated finishes – a review},
  author={L. Wu and Mark A. Ashworth and Geoffrey D. Wilcox},
  journal={Transactions of the IMF},
  year={2013},
  volume={93},
  pages={1 - 8}
}
Abstract Electroplated zinc finishes have been associated with the electronics industry for many years as a result of their excellent corrosion resistance and relatively low cost. They are normally applied onto ferrous products to provide corrosion protection in a range of different environments. However, the formation of spontaneously grown whiskers on zinc-electroplated components, which are capable of resulting in electrical shorting or other damaging effects, can be highly problematic for… Expand
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A series of nanopillar compression tests were performed on tungsten as a function of temperature using in situ transmission electron microscopy with localized laser heating. Surface oxidation wasExpand
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Zinc (Zn) whiskers are tiny hair-like electrically conductive filaments of Zn that sometimes grow from Zn coated surfaces (e.g., electroplated, hot dip). Zn coatings are commonly used asExpand
Investigations of Zinc (Zn) Whiskers using FIB Technology
Mitigation of tin whiskers on tin plated components is a critical issue that must be addressed by the electronics industry prior to the implementation of lead-free processing. The study of whiskerExpand
Whisker growth from an electroplated zinc coating
The formation of Zn whiskers threatens the reliable operation of electronic equipment with an electrical shorting hazard. As with tin whiskers (much more intensively researched than Zn whiskers), theExpand
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The filamentary growths of single crystals on material surfaces are termed whiskers. They are seen to nucleate and grow on certain electronic materials either from vapour and liquid phases or by aExpand
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SummaryTin coatings and some tin alloy coatings from various plating baths and on several substrates have been kept under observation for spontaneous whisker growth for periods up to 20 years. AExpand
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The global movement to lead-free electronics has led semiconductor device assemblers to switch terminals and finishes from lead-based to pure tin or high tin lead-free alloys. This transition hasExpand
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SUMMARYZinc whiskers growing from bright electroplated zinc have been observed on electrical components. Some whiskers were up to 3cm in length and others capable of carrying a continuous current ofExpand
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TLDR
Atomic force microscopy (AFM) profiling analysis is useful for characterization the IMC growth on the Sn and Cu interface, but there is no direct relation between whisker growth and the RMS value. Expand
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Filamentary growths have been found on metal surfaces of some of the parts used in telephone communications equipment, particularly on parts shielded from free circulation of air. The growths are ofExpand
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