Zero shrink LTCC 3D structure interconnections

Abstract

This paper describes design, construction and some recent tests of three dimensional stacked lead-free soldered structures based on Low Temperature Co-fired Ceramic substrates (LTCC). These structures have a great potential to create compact structure combining multiple different modules in one package. Internal connections used in these 3D structures have… (More)

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Cite this paper

@article{Nicak2012ZeroSL, title={Zero shrink LTCC 3D structure interconnections}, author={Michal Nicak and Boleslav Psota and Petr Kosina and J. Star{\'y} and Josef {\vS}andera}, journal={2012 35th International Spring Seminar on Electronics Technology}, year={2012}, pages={128-132} }