Zero level metal thin film package for RF MEMS

@article{Barriere2010ZeroLM,
  title={Zero level metal thin film package for RF MEMS},
  author={Fabien Barriere and Aurelian Crunteanu and Annie Bessaudou and Arnaud Pothier and Francoise Cosset and David Mardivirin and Pierre Blondy},
  journal={2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)},
  year={2010},
  pages={148-151}
}
Because they have moving parts, and they need to work in a specific atmosphere (vacuum, inert gas…), micro-electromechanical system (MEMS) are not compatible with integrated circuit packaging technologies. So, in order to accelerate commercialization of RF MEMS devices, the development of packaging technologies is one of the most critical issues that should… CONTINUE READING